. X. T+ h1 j; e. R% c9 ]4 ]- {7 |! V. Q" p' X
--------- 3 O8 M5 Z8 o3 d' Y0 B PROXIMITY , t6 x$ u# i0 a( V9 }( w ---------4 }& `; g9 B9 J
L7 O$ b- x% a4 O Use DRC Window : NO # W4 r5 V. N: c9 { * S& I9 T0 ]- }+ v, @) N" ^, f8 A, h6 S
Disable Same Cell Pad-Pad Checks : NO . U; k6 y N2 Y! a- d, O% |" x0 H9 J. j5 a% }/ `5 |0 V
/ p$ u. I/ Y! L4 V0 w5 o! Q
Enable Same Net Pad-Pad Checks : NO 7 X a2 C5 V9 ^7 R, f* z1 u* w6 R" O- |6 B* {
/ t* W& Y+ {' B& f7 a Layers Specifed To Check : Layer 1' i2 s4 M9 |" t- R" X, [7 p
Layer 2, a! u+ w; s% m9 M
Layer 3 d8 r( y. S9 [. j0 [# U Layer 4/ K, c W w3 N9 Y/ O# s5 p
# w) y" Z- X& _8 T
1 j- O! e8 |' s) n4 A b+ U& ~2 t6 O6 r
' y3 _9 i- l5 L, o
Net Class Clearances And Rules 5 ^8 y% z& J6 I6 S/ P* A ------------------------------" i3 Y* A2 m+ l: `% w4 g/ }7 f" c
* e; N/ z9 N/ m6 G* r' G
Components Layer 1 TO Components Layer 1, ?. ^8 Q- M% A/ |4 U% x
No Hazards.* f0 }5 f2 ~' X5 y8 _: y! r
' ?" ^( l' p- x- c
Traces Layer 1 TO Traces Layer 1 3 n b3 c" p6 d' V No Hazards.$ O3 o( |0 c# W2 W1 t: {2 Y) f
& j% X% N" r; w' A* C- v Traces Layer 1 TO Part Pads SMD Layer 1 % F: S% ]0 m- X, y No Hazards. 4 @; ^. }9 F7 K0 H; s4 f5 u, k, J, w' v% F; H) b, ?
Traces Layer 1 TO Part Pads Thru Layer 1. Y: g6 D% e @! D9 l
No Hazards.6 V6 Q- c3 x* A0 w
% G! Z1 [& n8 F+ j8 z% O Traces Layer 1 TO Part Holes Layer 1 / [7 K/ \5 m9 o3 p- S0 Z" X/ U& p No Hazards.3 j; k$ k- N+ S
. J2 {# m+ w( o: J- I' I
Traces Layer 1 TO Via Pads Layer 11 i) V% n8 k# O- M/ z: M! P' v
No Hazards. - i: `+ X/ z) U' P 1 N/ f6 I- I, u( N; V6 r: F ? Traces Layer 1 TO Via Holes Layer 1 1 T* W t' S' w; J No Hazards. E& ]* f* d: r9 K7 O
: ]/ L. n1 {8 A i8 {
Part Pads SMD Layer 1 TO Part Pads SMD Layer 1) {7 z' v# \) A# }9 o1 H
No Hazards.8 \4 g$ r4 N$ F1 O- I" N Y
' o+ m: ?3 }) M/ R2 G& T
Part Pads SMD Layer 1 TO Part Pads Thru Layer 1 6 h# h/ Q r% s No Hazards.3 C6 u5 ?5 S2 t! X# E
1 G3 c: ~8 P; D- M2 K/ ~ Part Pads SMD Layer 1 TO Part Holes Layer 11 [4 a1 i1 _2 T: m, l A$ b5 ?
No Hazards. , D) }$ T, c& L/ V' }* d+ d0 u- {9 v7 j: ^1 q" ^' E2 c4 u
Part Pads SMD Layer 1 TO Via Pads Layer 1. z. e$ E' L9 L \0 L
No Hazards. $ r x' [8 c3 u' B+ t# N$ H; Y8 ~* _7 j% h, v' Z+ q1 R! m) }
Part Pads SMD Layer 1 TO Via Holes Layer 1 1 F, v: t- |4 Z* ? \+ D1 x1 {7 E# Q No Hazards. 8 \5 r& U- T8 e7 j) E! t8 U ( b) i" V# j+ D Part Pads Thru Layer 1 TO Part Pads Thru Layer 1 9 z/ J& s+ H, o1 v No Hazards./ M. Q5 S; A6 u: n+ _
* A9 i1 t, s# C3 J
Part Pads Thru Layer 1 TO Part Holes Layer 10 G% }* A: ?1 }: ]3 x
No Hazards. ' p% U* h# D+ J8 O- M% a9 a. V# Q( A- ?( Y; J' q2 x
Part Pads Thru Layer 1 TO Via Pads Layer 1& b9 ^8 [+ q V2 @& _) b
No Hazards. ' W4 G. ^4 ?! I# ~0 `( t u' }# i 2 z+ E' [3 p% h9 L2 } Part Pads Thru Layer 1 TO Via Holes Layer 1 + z F8 o1 n- ?4 n No Hazards.* H6 \ L$ M, p( p& ^2 v( C
: ?3 }# z6 x) p$ s0 k. o3 k
Part Holes Layer 1 TO Via Pads Layer 1 8 B6 z0 O# v2 H! Z1 p0 W No Hazards. 6 X8 C) u/ w( `! k: ^( S- z. p" H0 F( ?
Part Holes Layer 1 TO Via Holes Layer 1 * w( o/ j- n; r6 Q q No Hazards. P+ D* [* I3 F9 U7 [9 O; G3 \( l; U+ h# A, c1 V' z% h+ C
Via Pads Layer 1 TO Via Pads Layer 1 ' U. A9 W. N9 a: j2 p! V D- h6 d No Hazards. * m. U6 X7 v6 ` ; o" Y! c: O0 L$ c Via Pads Layer 1 TO Via Holes Layer 1# J" s+ C+ W6 W1 g! P
No Hazards. 3 d" S2 e' O8 N7 _- J! b8 x) Q7 n' ` J2 o' n
Via Holes Layer 1 TO Via Holes Layer 1 ! M& _$ K8 b7 |& Z0 w: { No Hazards.8 ^/ u; E- f' s6 {% s9 p/ Z. ^
. h/ C, r: y' u# l/ V Part Pads Thru Layer 2 TO Part Pads Thru Layer 2 + C/ Q" V3 ^% w& h' d No Hazards. + J. q5 f9 C8 ~, Z# p ; {3 Y7 q+ K4 L% |$ [1 m Part Pads Thru Layer 2 TO Part Holes Layer 2 ( {& J+ K( T8 H: D# e No Hazards. 0 c8 \$ h' w! ^: v # k/ \; f6 Q. O Part Pads Thru Layer 2 TO Via Pads Layer 2. S$ c5 {8 _' D0 n. {9 K. I) m
No Hazards. 8 U. z& i6 |2 x) I" T8 ?, k; p4 ^& L5 N1 `! \: Z9 E6 K
Part Pads Thru Layer 2 TO Via Holes Layer 20 J# T. V) t4 {0 w _- c) w/ D
No Hazards.* Q# x3 D* q* G- U: M8 E# }& W
+ w0 A& P3 ~0 U# g' ^ Part Holes Layer 2 TO Via Pads Layer 2 : A1 b0 M1 r5 Y+ H( X! g- o" s No Hazards.* \# T4 M9 R' ]: S
. E& a u5 [" K% ~; v$ ]2 z2 \ Part Holes Layer 2 TO Via Holes Layer 2; E& l+ d2 a m' Y0 q# K* B; \
No Hazards. + h1 }- I6 _0 v5 a, `8 N2 p) r) k' _4 R8 Z N5 H0 y4 [3 b# L1 v- C
Via Pads Layer 2 TO Via Pads Layer 2 ' {$ A- M& t' J No Hazards.; I# B, d0 }/ B: ?
B$ N# S$ r* E7 d4 c% x
Via Pads Layer 2 TO Via Holes Layer 25 p9 l3 W+ g% R" B( e+ Y( r
No Hazards. + k5 E/ {& X6 x" j# F# ?# p0 H) Y8 x/ r9 @, ~
Via Holes Layer 2 TO Via Holes Layer 2/ b2 r8 J' \ @$ F
No Hazards.& w1 T' l9 Q" Y- Z% r: E' T
, Z6 _ Q J% t2 ^ `
Traces Layer 3 TO Traces Layer 3 * }$ v+ Y* O' I- P4 {7 ? No Hazards. . C4 c" V9 s* \, y) `* N$ \5 t D9 n7 ~2 a9 D" p: O7 g
Traces Layer 3 TO Part Pads Thru Layer 3 M% b$ d, ?. ~+ w. G$ d; U
No Hazards.3 r/ _# H# w/ ^
& u! v' i- R9 C- X& U& O4 i v) v
Traces Layer 3 TO Part Holes Layer 3 f/ P! \4 G% @+ H# B
No Hazards.. H% e& L G; }$ Z& U
. K' M/ k" E+ V+ R4 R1 i9 d1 h/ L Traces Layer 3 TO Via Pads Layer 3 . h1 E0 _. z, s% g8 _, p+ @# E* M N No Hazards./ l0 w* F! G* Q% Y) E- N
x- z7 ~" g9 z
Traces Layer 3 TO Via Holes Layer 34 \) r4 T" e2 I5 G* M* A
No Hazards./ ?( `/ }; M7 T
. \& j4 ` W5 u8 [( ?; L Part Pads Thru Layer 3 TO Part Pads Thru Layer 3/ g4 u9 ~( I0 P% F& B% ^# m
No Hazards. 4 i( O/ g: D; X4 ~. b $ h$ ^* Y4 [/ u0 m) n4 T Part Pads Thru Layer 3 TO Part Holes Layer 3- j+ }% J: \% ~, W! l# N& R
No Hazards. 0 U' d' h! E* ^% W& Q m/ X- D; y
Part Pads Thru Layer 3 TO Via Pads Layer 3 + J" f- O8 f+ Y7 ?$ H* x/ n0 Q3 e$ k$ W No Hazards., R3 h1 Z* C; e' l' h e7 @( f
5 z) O- G1 a2 Q; g# g
Part Pads Thru Layer 3 TO Via Holes Layer 3! j. P& h4 k" B+ z
No Hazards. 4 S, r/ Z$ @! |3 n' D8 Z: O# ~2 M7 ~5 B9 H
Part Holes Layer 3 TO Via Pads Layer 3 {+ H2 Z8 O2 T" f! y" ]+ I0 w
No Hazards.* d$ N; }, G9 m- J" p% G3 P
2 B/ w% l; y+ f Part Holes Layer 3 TO Via Holes Layer 3: m( j4 t+ X7 i$ r
No Hazards. ' F- Y' g8 x/ w8 ]: n/ r' ? ' Z2 a; n$ P' c ~" y# D3 O1 ` Via Pads Layer 3 TO Via Pads Layer 39 x* G/ `3 Y g) p# \( i* n5 Q7 K9 G
No Hazards. 2 U1 M. G( H& h8 V# I0 m, h0 O7 k* q5 R$ n; D
Via Pads Layer 3 TO Via Holes Layer 38 K; B8 d2 ?1 r" V1 ]. r. Y' Q) x
No Hazards. & Y& F" D) T8 D6 k% j ; l& w$ g3 W, A/ D3 d; P8 Z3 J Via Holes Layer 3 TO Via Holes Layer 3 " L- l2 J+ e, m' \$ M1 x No Hazards.( f$ g& W/ F. D
/ a4 l/ S S0 }% b% T" |/ @: h+ Q
Components Layer 4 TO Components Layer 41 [2 j0 D, v. E( }' ~, W
No Hazards. . } } {) l# y+ E6 y9 h! l8 @ ! W+ f8 c; S E% ~2 k; X7 K Traces Layer 4 TO Traces Layer 4! v/ M9 k4 W7 R. G
No Hazards. $ G& d8 v" B0 ? J$ `3 w3 N7 s& F# V" G5 C+ H9 y
Traces Layer 4 TO Part Pads SMD Layer 4 1 e- t; d7 J' k5 v3 w4 |1 y* _% E No Hazards.1 {" s& P% e( K' f9 `0 D
$ Z' E3 a" S+ i+ g Traces Layer 4 TO Part Pads Thru Layer 4 & D4 R$ A/ y4 W& V2 O No Hazards., V" D9 s' f; F
+ h+ G4 q& F( ^! A+ q- W Traces Layer 4 TO Part Holes Layer 4 2 \6 j. f( V- e% i: j- ^' O3 Q No Hazards. & H2 g7 j; N& @; o0 ^3 {! n# K' y! y+ x+ W8 i% j+ T
Traces Layer 4 TO Via Pads Layer 4 , ?4 u0 a8 W4 x4 ?$ b: C/ f. p No Hazards. 1 Q/ [2 B3 q& b X3 Z6 w$ V @6 h- o+ X
Traces Layer 4 TO Via Holes Layer 40 |# Y8 ^6 h1 x7 O+ v& @( `% \
No Hazards. 0 ]1 h, t8 C! |3 F& \; w, |& u$ H: r: h: Y
Part Pads SMD Layer 4 TO Part Pads SMD Layer 4 g' ?" g+ g( B No Hazards.& H% `7 ^5 ~- i7 E- @& y$ u
/ P, {4 r# \/ P
Part Pads SMD Layer 4 TO Part Pads Thru Layer 4 : B6 a8 ]5 u3 ]& A9 y. n2 u. H5 ^ No Hazards.* }# P' e5 d. C5 w* P; ]
- ~* U$ f' p+ y/ n) l; I* e" H
Part Pads SMD Layer 4 TO Part Holes Layer 4 - W* \) v( @8 _# T2 A& [1 t# j% K, a No Hazards.* o$ j& p3 `" {
( ]3 B4 O+ c4 P% W' u Part Pads SMD Layer 4 TO Via Pads Layer 4 ) y5 x, e3 i) f/ x# P/ M* x! s( f No Hazards.4 ?( k d/ v" }. Y. ~& d; v* z
2 A) l: q5 c+ Y+ e& q
Part Pads SMD Layer 4 TO Via Holes Layer 4+ M3 A/ z% S$ r9 `" d
No Hazards. ( A2 F& v$ Y5 [9 d7 r, r ( g! w- w5 e1 m- s" D5 A1 R9 I+ ~ Part Pads Thru Layer 4 TO Part Pads Thru Layer 4 " T8 S. B7 u% ?# p! P No Hazards. ' O5 e. h/ f+ I$ Z# A+ [6 _- M# r4 O, Y! ~4 c( J* S0 Z
Part Pads Thru Layer 4 TO Part Holes Layer 4 * @5 e5 c* H; h! p. a$ \7 g& N No Hazards. / N8 U7 Y5 `% E7 F) s0 j 5 z$ O6 e! q. M$ { Part Pads Thru Layer 4 TO Via Pads Layer 4; ?& v4 g+ p' j$ b
No Hazards.3 I. O/ y# K2 Q' N( T, A0 d6 j
4 j( |8 D2 Q5 a. A- e% Z4 n7 N Part Pads Thru Layer 4 TO Via Holes Layer 48 P& ?8 ]+ D+ |
No Hazards.$ g/ T) C8 P! }1 x1 I0 \$ y9 U9 L
( u! Z0 D% v. y. x9 r
Part Holes Layer 4 TO Via Pads Layer 4: _& S9 [+ f' K9 Z
No Hazards.* T2 I, m6 u& V3 q8 t8 L! A& A, e
. h: J2 y: l, O9 t9 ~% R
Part Holes Layer 4 TO Via Holes Layer 4 % b- v: z6 y5 S- b1 ? No Hazards. + d6 J- A' g5 w3 e% v6 c" F( M3 L ?
Via Pads Layer 4 TO Via Pads Layer 4 " D O7 H, y2 i0 t No Hazards." R' z9 C2 M. T2 y' \' S
1 E- b" y3 h! N2 t/ v- @ Via Pads Layer 4 TO Via Holes Layer 4 S: C! r- P! z) I7 Q1 v
No Hazards. 9 |7 y# l( o" z( H) D6 ` % ~1 b' p9 X! [' j4 b! \+ I6 ~5 A2 t Via Holes Layer 4 TO Via Holes Layer 4' o) j& F- T) K3 G# G1 ]" A' K
No Hazards.' a+ O5 T$ z! m n1 U7 c; A3 f
B* L. A- b& z; m" @
, p5 Z( z: J1 s0 Q+ ? Total Hazards Found : 0" T2 z- Y: X" N5 ^# c/ K5 w0 _( F
! M- Y9 @4 ~4 O. d. x/ f # u) U$ j. U! B1 v: M4 @- `: z; d% k i5 R* O! w' C
- ?) |" y: b/ }4 L
Planes Clearances And Rules 5 z/ _5 b+ N( I- [' ~1 b% K --------------------------- 4 V5 X" ^% B+ c6 N: G( b/ b. s1 Z) D* Q
Positive Planes Layer 1 TO Part Pads SMD Layer 1 / B% I3 M: k( h7 v7 R# u No Hazards.# m% [/ p- _: ?1 }3 i6 L. ]/ c
& Z7 d8 W: {4 G% a! j$ N Positive Planes Layer 1 TO Part Pads Thru Layer 18 H+ y6 T6 |; w" T) V/ k
No Hazards.- n' \- T* B9 t9 B, Q
1 y7 f4 D7 P- f# `" I' u% W
Positive Planes Layer 1 TO Part Holes Layer 1# e0 @ R5 e7 o% |* B! P% B/ V
No Hazards." O7 |# m+ v! v$ i: y
/ B$ W2 F) b5 X! g3 |. B
Positive Planes Layer 1 TO Positive Planes Layer 1# m! U8 b: }: S; l# y- n8 a, L
No Hazards. & ? K- u. K! Y) P2 ] ; p# e# a: V& W, f0 o9 ` Positive Planes Layer 1 TO Route Border : @& Z k& ^" }* w3 A7 W: s No Hazards.* ~- H* y8 K) V; b b H/ v
4 ~8 w' j4 ~" _ Positive Planes Layer 1 TO Traces Layer 17 u- [. Z- q z; q3 k; G9 a
No Hazards. 6 h |- B0 U1 [+ r% S7 ~! Y- {2 Y4 ^1 D! U4 k
Positive Planes Layer 1 TO Plane Obstructs Layer 1, J: C# k/ Z: `5 G4 x3 }2 N
No Hazards. : [2 _$ v3 c* I1 _1 @ \- Z) X& G! h. G: q& D. H! E: h
Positive Planes Layer 1 TO Via Pads Layer 1; [+ k1 c: Q, }, K$ g' A
No Hazards.3 g" F9 C% E; S9 {+ n
, h" s' {# D& l9 B# J Positive Planes Layer 1 TO Via Holes Layer 1& F* Y- V" X7 f- `
No Hazards.% { Q; w8 d e
a F, X" ?2 g1 Z2 q6 d0 H
Positive Planes Layer 2 TO Part Pads Thru Layer 2) Q( d$ a' P+ C* |' v
No Hazards.1 h! M2 b" W0 F$ S9 \) a: z0 d
/ q& T* }4 A. a: K) s4 o Positive Planes Layer 2 TO Part Holes Layer 2 K, x! x+ B g9 |6 h No Hazards./ d1 g C7 g& N! ^7 ?9 Y+ Q
6 }0 p, v& a9 [* _& ?
Positive Planes Layer 2 TO Route Border" z* H3 T' Y- s2 i& `* n
No Hazards.6 g+ L. m$ _8 z
8 F. }- C7 e2 U8 Y Positive Planes Layer 2 TO Via Pads Layer 2 5 ^) u( m( Z- h/ I- c: l' j No Hazards.* j: o+ J! F2 ~' H$ ~
9 F/ k- Z, D1 N9 S2 F6 e0 u& M# U; K4 I
Positive Planes Layer 2 TO Via Holes Layer 2 3 k/ U B$ ]4 ` V& h& S4 W# M3 b No Hazards. , z2 X! W+ n1 Y9 A$ H, j . H; t, }( e- E( q- B, T Positive Planes Layer 3 TO Part Pads Thru Layer 3 7 ]( R. t# w9 M/ O. a& u No Hazards. / ?/ q# A3 j0 @9 ^5 k) k( R8 [1 K+ y2 j3 J* ^6 X
Positive Planes Layer 3 TO Part Holes Layer 3 & f* ^ ^' g" B5 Q No Hazards. % v! L4 f- c! q # `( H: j p5 W6 |6 c Positive Planes Layer 3 TO Positive Planes Layer 3& Y8 K) c3 `7 H( i
No Hazards. 2 T& C( J( D' W7 ?' B+ b 3 T% N; s) _) v# l" A g9 H" E Positive Planes Layer 3 TO Route Border : G# X& I+ M# U @: a* W4 G, E No Hazards. 5 {8 T# M4 ~2 e/ d* j# c1 ?3 R$ F. C! Q
Positive Planes Layer 3 TO Traces Layer 3 8 J1 M9 j/ K8 T No Hazards. 1 T1 c# F/ s( D- D" G1 [- a- z: }$ E6 u
Positive Planes Layer 3 TO Trace Obstructs Layer 38 A0 ^4 e7 ~3 y9 B# u0 H( S; o, i
No Hazards.4 v% \6 _( Q9 Z1 q
! |/ l) j) A7 R$ o Positive Planes Layer 3 TO Via Pads Layer 36 a! t* Z% d4 T- r# u$ @& z6 A
No Hazards. - |* \2 n) u2 R* m 8 T/ L, F! D0 L u7 \- o; f/ Z Positive Planes Layer 3 TO Via Holes Layer 3 + Q5 M* g% L+ T2 z. _+ k) u# \" L) ` No Hazards.& B: o A6 \3 C9 H
3 D E/ l$ D3 L& y# f
Positive Planes Layer 4 TO Part Pads SMD Layer 4 6 d5 r, F$ K0 y& m3 G" E No Hazards. & {+ x+ o$ f3 [7 ~( k3 K Q* u+ s4 B; U' _9 o7 {
Positive Planes Layer 4 TO Part Pads Thru Layer 45 B% `% H* x0 H, T0 P4 U4 m1 ?
No Hazards.+ J1 V2 b; y; K" A R/ j5 |) B$ O
- d+ L, b7 w t
Positive Planes Layer 4 TO Part Holes Layer 44 B: ?# U7 @ r/ J+ e2 Q2 T* J* B. d
No Hazards. ( m4 W# S. a) V# \' ?' B! o- y
Positive Planes Layer 4 TO Positive Planes Layer 4 ! L) l7 m$ P# G6 ^. N. ] No Hazards. 4 @! b( |4 J3 {" K ' T: W! D( g$ |1 X5 ^5 Y/ F$ z Positive Planes Layer 4 TO Route Border! N+ h0 ~0 N7 c
No Hazards. 0 S, t5 q! v% G& r - v. [& u9 I2 B% ?6 Q) L Positive Planes Layer 4 TO Traces Layer 4 0 l. l9 w# D5 l3 J5 p. Y T/ I No Hazards. " I# [: m% { p4 g7 M% w% c& H1 ~$ L, H- A4 T- z; X9 u) P% t
Positive Planes Layer 4 TO Plane Obstructs Layer 4, k, {9 v* J( W( h
No Hazards.! h1 U$ R e* _
2 ?' I9 V, f9 d1 T" h
Positive Planes Layer 4 TO Via Pads Layer 4; c, V4 y( m9 T! Q; V
No Hazards. ) j) y" ~/ \5 E' Z* T8 ?$ y, a; h3 Y8 s0 s; b3 H" \
Positive Planes Layer 4 TO Via Holes Layer 48 m. v3 h6 Y; a3 p7 Q; f
No Hazards. # m$ G; f# m, T5 A# w" W* [( p; C9 U a+ i- G% a. f8 g
0 `6 U# ^9 e# q6 Y Total Hazards Found : 0 - o2 c% }: R% y 9 k5 I5 _: ]0 U4 Z1 H( ^: e& c8 D& V1 `# r* F3 n
: J- G$ A3 f" R" B/ h' `6 H7 H
- W: K% G) J- `/ ?2 g! S
Non-Net Class Element To Element Clearances And Rules - R, v0 i4 ?2 Q$ Y ----------------------------------------------------- * Z! ?6 D) s* d5 {# }4 ^' Z 0 M! G1 ^! L1 z0 L/ y Route Border TO Via Pads Layer 1 Clearance: 0mm7 Y# h( }5 `; R0 T' Y
No Hazards.$ f8 x( ?% N- L0 N& Q
2 t4 [* G( v# V2 C! o# n8 d Route Border TO Traces Layer 1 Clearance: 0mm " F o2 I* P' L No Hazards.% z+ N9 v, w7 o( v
9 z- {0 h0 @: s
Part Pads SMD Layer 1 TO Route Border Clearance: 0mm % v0 T$ `1 G8 f! U* ^8 ~ No Hazards., c& P* R+ q O% R: E
% `4 z% _- m, F- v q
Part Pads Thru Layer 1 TO Route Border Clearance: 0mm S% J+ J; E- k% u8 p2 K No Hazards.8 S3 Z1 f; H5 }, N* }3 h
* x, Z' G- U% y$ e* L2 |7 u Board Outline TO Part Pads Thru Layer 1 Clearance: 0mm1 G9 I3 O1 d$ h. l J; o/ R
No Hazards.5 |) |9 a8 A, [; N/ ^0 V
: g8 V9 v2 G0 x, ^$ b5 A Board Outline TO Via Holes Layer 1 Clearance: 0mm / \0 r7 X( D7 q8 ? No Hazards. ) X/ }* M7 ]; I2 i! z9 i # v: j2 m) o. b$ t" w+ K( U9 k Board Outline TO Via Pads Layer 1 Clearance: 0mm 6 c9 ` y5 I" M% Y, F; F No Hazards.$ U# g" \5 J( s3 v
$ S' }* f3 K4 P. K$ y- j Board Outline TO Part Holes Layer 1 Clearance: 0mm# P8 c2 S7 o# E8 Q
No Hazards. 5 i) U( p8 R$ P5 H4 a( G( @3 J% d o! m, A9 E
Board Outline TO Placement Outlines Layer 1 Clearance: 0.25mm 4 M# @3 Q# k+ Q- P. Q No Hazards. 0 p! P9 |6 x- [ / @( g/ w$ e! Q) s K; ^ Board Outline TO Part Pads SMD Layer 1 Clearance: 0mm 1 e0 G6 a* R S3 b% ? No Hazards. * V5 D% w0 `2 S# B% \( c& D" v& V % f- u" h; @/ K v4 i Board Outline TO Traces Layer 1 Clearance: 0mm $ ~* E z/ K, ], K0 P% a No Hazards. 2 d$ ~( O! Y2 G8 u v; ? x, M) P C, C1 {! h Route Border TO Via Pads Layer 2 Clearance: 0mm5 ~, o$ j# z$ r% G) g+ h( G/ T
No Hazards. : S& |. ~# y3 `- Z7 c3 ]1 M / ]% q" b" y! H7 L0 c3 R8 K& Q Part Pads Thru Layer 2 TO Route Border Clearance: 0mm : {' M+ u5 H2 B No Hazards. % h9 E# P! x( B( G8 m% z+ E1 A% D' F+ `
Board Outline TO Part Pads Thru Layer 2 Clearance: 0mm * M) l6 O* {# c, R J No Hazards. 3 q4 _/ c* G% b5 Y* v3 }" H( M: X- }9 n' O4 W. }( @
Board Outline TO Via Holes Layer 2 Clearance: 0mm" l6 e }. f6 n/ }( I( y
No Hazards.. W' Y: w; T# K- c
/ T$ x9 H3 z6 R: x Board Outline TO Via Pads Layer 2 Clearance: 0mm5 o% B: q& ~. v8 n; F1 c
No Hazards.$ Y4 l$ t; p2 ]: h+ [' L) A
! ~; q0 b6 y x, D2 H/ o; F
Board Outline TO Part Holes Layer 2 Clearance: 0mm7 q, m* G3 }" X' a% G1 W( I
No Hazards. 5 f# X6 ^3 L; G* [- y* R / y: H0 L* T- x0 E6 K' _ >> Via Obstructs Layer 3 TO Via Pads Layer 3 Clearance: 0mm . n! y5 j @' [6 I/ ~ Hazards Found : 62 U8 Z; k- k; N0 y# r2 L7 V% e
6 Z1 [" ]! p1 J8 d) |; E7 v >> Via Holes Layer 3 TO Via Obstructs Layer 3 Clearance: 0mm , e8 g# j6 K( X* z- k! n8 K6 P0 f7 v Hazards Found : 6, W8 q8 ^' ?. l2 G3 [& l
7 S& a: Y3 B6 a( p
>> Traces Layer 3 TO Trace Obstructs Layer 3 Clearance: 0mm1 \" M1 g; }$ H
Hazards Found : 1 & W2 A% q7 Y2 w) t7 a& \8 J' V) A- o: j( B
Route Border TO Via Pads Layer 3 Clearance: 0mm 2 p: d0 R' m- x/ L- t! E3 G: L No Hazards. `' r# f5 ~1 |) B1 v4 D" R6 [% r# X, V' K( Z
Route Border TO Traces Layer 3 Clearance: 0mm - q. q5 k: t$ a! n$ U; X8 b( C2 \ No Hazards. # b- J0 W/ d- N- G1 y8 u# b5 O; w7 a; J* a
Part Pads Thru Layer 3 TO Route Border Clearance: 0mm J2 J3 X9 b% p* x9 M No Hazards. 6 \& q0 C: s' b' L! N/ K3 Q5 N- p- n! Z( G% @4 N
Board Outline TO Part Pads Thru Layer 3 Clearance: 0mm. p( _1 i' h l. N! s
No Hazards.3 p, ^$ E, L8 J3 W$ P: K M: L
/ |8 \) S. [6 D
Board Outline TO Via Holes Layer 3 Clearance: 0mm ( f3 _; ^7 W! X5 q3 f2 }2 h No Hazards. " y" `, ^9 Q5 ^! I) W7 C# Q) S5 S1 h9 J! v; ~ b" x$ {
Board Outline TO Via Pads Layer 3 Clearance: 0mm ; W/ J) [- b2 V$ [ No Hazards. 1 b, `% r1 w7 ^( l # v% z6 _' ~$ |3 i9 D" W5 C6 [1 k Board Outline TO Part Holes Layer 3 Clearance: 0mm 7 @$ B3 s( {- y: w" b No Hazards. : d, }! @# L5 O& U( y9 F ' q+ e V- Z) {" E; r: D# Y Board Outline TO Traces Layer 3 Clearance: 0mm % L2 }5 ~) D) k6 l1 m. I No Hazards." s2 x J! v1 x; h% Z
2 Z I) z# j5 a! \7 Q+ x$ x( M8 a+ L Route Border TO Via Pads Layer 4 Clearance: 0mm( d" H) q6 k* f
No Hazards.9 L, G0 M& s" b, l* Z( c8 b
6 \, e$ i1 E# y8 L3 e: D1 k. }
Route Border TO Traces Layer 4 Clearance: 0mm 0 _ K9 w$ R$ l3 e( ^2 m No Hazards.2 g; |. J; q% X) ~/ ^# E8 o: E
d1 s' T3 L* Y( W( m8 d" T Part Pads SMD Layer 4 TO Route Border Clearance: 0mm " w! c8 y4 A# l. y- j No Hazards.! @) _1 w/ q( E9 z% w9 x. U
6 X A1 M% p* d- c
Part Pads Thru Layer 4 TO Route Border Clearance: 0mm 5 U0 B, y# }# O7 B; `. Y( u ?" G# W6 o No Hazards.9 a7 B& G. {& J! S9 ]$ |4 y: F+ d
. W! {8 ?2 Z. A7 E; n Board Outline TO Part Pads Thru Layer 4 Clearance: 0mm - ^5 n$ `& G: i No Hazards. ) w) Z0 s3 J& f, X8 E+ a* r$ n% ^& B6 n, ?$ N
Board Outline TO Via Holes Layer 4 Clearance: 0mm : B- e0 A v% @5 G/ w3 ~ |; X No Hazards.+ Y* |! m3 ]0 e" {0 ]
. J5 N7 a0 ] N1 E Board Outline TO Via Pads Layer 4 Clearance: 0mm - T/ [8 k7 H, _" }- h, G4 \ No Hazards.. O" K p! j2 V% o. K. A u. _+ W
- T% P, v( W' Z/ X g Board Outline TO Part Holes Layer 4 Clearance: 0mm3 Z$ ?8 }4 h+ d1 `- a- b
No Hazards.1 D' e& K' a4 k/ w( t' L
8 x+ w% n g4 x- [) B( @ b h
Board Outline TO Placement Outlines Layer 4 Clearance: 0.25mm . j+ s: V- X+ d3 I3 q. V No Hazards. 8 Q' T, d2 O( t$ S+ o0 [1 ~) c * {- q& ?3 m9 h) d) r3 g Board Outline TO Part Pads SMD Layer 4 Clearance: 0mm 3 J5 n9 H: @6 {7 L/ ] No Hazards. ?+ x: `8 y8 s9 K3 M) ]' i$ N, g. ?$ R
Board Outline TO Traces Layer 4 Clearance: 0mm $ m" c/ V9 R) q4 M$ G! f8 Z No Hazards.( C6 a/ T$ f6 d/ A
$ m/ t2 e! D( X# `/ u0 V" N
* j- E, `8 J/ ?
Total Hazards Found : 13 9 b- H& v+ q5 i6 N1 s. X / M' u$ q( W4 _5 z1 Z _+ D * B; ~3 s( b! h! @# O/ [' h3 c9 G. P4 K; P/ L/ i0 D" Z5 I$ k
Total Proximity Hazards Found : 13 ( H- I" F$ Z/ z2 c5 {8 D e' V* E; Z, `
* l& x4 Q m4 ?, r. z1 ~" x7 d. v8 e- N E' S3 J( K) M) }
# m$ v( U8 R3 d* Y v ---------------------------- + s4 G* g$ s- U5 T0 _0 g) W CONNECTIVITY & SPECIAL RULES 1 N D1 |6 p C6 ~) N+ i, f: g ----------------------------2 N3 ` n( B6 f( f" [5 H3 g& h
. `" F9 K1 b, _ ! N% P. a3 ]) z+ _' T Check For Unplaced Parts : YES' k H% Z5 l( a% m, s
No Hazards. ) O2 P& C* }5 i, r2 }" m0 P' s J" X3 N
5 ~! E- q$ j% c0 w# l: D6 J
Check For Missing Parts : YES $ V: A) T& v/ l No Hazards. 9 y8 j4 Y, m( f& p5 @. \" u( Z8 F9 M9 [- H# Q6 t( y0 P
6 c7 K! w" ?* F+ z
Check EP Component Hazards : YES3 H+ F* I+ ]" F. k. v: e
No Hazards.* h3 ~1 E4 C$ n$ r9 C
z- \5 v0 e" N! d' X9 B" H4 n& r
& @ ~. B* J- t Check Trace Hangers : YES" p4 n, @% Z% @/ K
No Hazards. / B9 z, {* Y6 S: P! n 6 Y, u& [; V5 I9 q4 P6 ?5 s- Q6 ]: q 2 ^& w, D2 U! @; \ Check Trace Loops : YES 1 K2 R% W/ i% ~ @; ?4 F/ x& \ No Hazards.' g" e1 r3 I0 U x6 v( D
/ Z% }& J7 H& K6 D, x* |
$ W/ q2 p, _: L P' h. r! r Check Trace Widths : YES$ b7 J' B. [7 W+ C2 j4 `" h
No Hazards.6 j# e1 n3 S) c9 @6 u* D* z) W# F' g
9 E+ c& i$ h# H2 {: T/ z3 r. C
) E: \, V, ~( y: x
Check Single Point Nets : NO; X/ W2 U+ L* e, Y% G: M
$ j! \+ w/ |6 I* Y$ ]& b ) B' `% ~. t4 y5 Z' a r! w Check NonPlane Unrouted/Partially Routed Nets : YES$ R9 D# f2 E/ Y
No Hazards. 6 h% l( @5 R1 a' i* L# K5 j' f+ _- R( n5 _
: C/ l& N- Y M" w" k, B9 U3 N Check Plane Unrouted/Partial Routed Nets : YES 6 N( T8 \; k6 l6 W. h3 Q: E No Hazards.; Y3 a8 Z" |3 r% L. J
" E, k! d" v9 K/ Y
4 \( U/ `- ^* d
Check Routed Plane Pins : YES2 I, @( O' k, h2 f$ H' X: l
No Hazards. $ G2 H& V* }4 l; L z3 U/ \ % X f6 K8 y8 {5 I & j3 a' ]/ l2 S Check Plane Islands : YES 8 u) H/ c; k, v6 ~# O t% X0 _ No Hazards.( d5 j3 T. b, [
: D; A+ [. w$ P) A. | Check Minimum Annular Ring : NO& n' ~* \& s9 }( u& d$ n& D
" ?' ?4 `2 y9 n3 [ m5 M6 g: E, N! ?# q 7 U. E* J' ~# @' }/ C Check For Vias Under SMD Pads : YES$ M: U3 p$ y4 [$ ]; G2 E5 Q
No Hazards.$ M4 g' I: d+ `
3 o6 @3 \, v- P. m
[5 X6 Z5 `1 Y1 y8 L% i% i Check For Vias Under Top Place Outlines : YES b( \( g4 t* O; N+ Q& r/ ?" N2 P
Hazards Found : 25+ I, q7 q* Z0 m0 X, H
/ N3 r6 G% U# v3 L
1 M8 E. m7 [- w! o: p* I$ }8 ? Check For Vias Under Bottom Place Outlines : YES , q! V0 V* I: f- X0 A8 ` Hazards Found : 11 ' n# \. d% d% b* {) z/ e/ A, I" F/ G S* W& L( ~3 O
' t; u2 c& c% T+ _" r Check For Missing Conductive Pads : NO' Y. H7 p x0 Q) ~. n" _
3 U+ g/ b9 S) a; o9 q : ]/ g, ^3 h& g2 B3 h Check For Missing Part Soldermask Pads : NO + I( c; m6 o% S( V 1 g) O* I+ z- K. K' S ' B: Q$ k. X" x c- o6 S Check For Missing Via Soldermask Pads : NO 6 @/ P+ @7 W) M8 S* Y( x( f# t5 v1 O! [5 j$ ], d; G4 r: w3 h5 v
/ |& E9 n' U4 y* U7 w Check For Missing Solderpaste Pads : NO1 i: `5 ?4 b/ x8 P
5 T8 S3 v' `8 U# p
! W# [5 p. G+ V, Q% r
# K4 S: t2 g, G) v
Total Connectivity/SpecialRules Hazards Found : 367 u, T+ k9 l0 q9 ~: ^6 K, f( m6 j5 Z
8 x6 T& w+ ~# t! }
. ?* F4 @6 M9 V. u
& Y: @7 h, C( U, E
==================================================================== g, m1 z6 H1 x8 d) _ ' o' B$ ^5 r! f7 l% O6 `$ _ ' M/ ~0 u# P% e4 t+ R' k; e* t" w6 Z
Total DRC Hazards Found : 49' L; E: N* ?1 u
