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本帖最后由 stupid 于 2012-12-5 20:00 编辑
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这是SI界的大牛Istvan Novok收录的为数不多的华裔作者写的SI书籍，2012年4月份出版，Amazon有售。
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7 [+ B) M: Q6 H# B; u8 BER-PING LI, PhD, holds an appointment as Chair Professor at Zhejiang University, China, and has also been a principal scientist and director at the Institute of High Performance Computing, Singapore. He is a Fellow of the IEEE and a Fellow of the Electromagnetics Academy. He has received numerous awards and honors in recognition of his professional work from the IEEE and other professional bodies. Dr. Li is a pioneer in the modeling and simulation for signal/power and EMC in integrated circuits and electronic systems packaging. He has chaired or spoken at numerous international conferences and universities, and has also served as editor to several IEEE Transactions.
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就职于新加坡高性能计算研究所，是浙大的客座讲授，持有IEEE和电磁学会的院士证。
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New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems% y% c7 d6 s, E2 m, P% p
8 N& r3 t) c6 ^' ^; ]Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package structures, integrated circuits, and printed circuit boards. Readers will discover the state of the technology in electronic package integration and printed circuit board simulation and modeling. In addition to popular full-wave electromagnetic computational methods, the book presents new, more sophisticated modeling methods, offering readers the most advanced tools for analyzing and designing large complex electronic structures.
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5 X* [# a9 h: O) J4 ^. sElectrical Modeling and Design for 3D System Integration begins with a comprehensive review of current modeling and simulation methods for signal integrity, power integrity, and electromagnetic compatibility. Next, the book guides readers through:0 [" p' d# o, W! @7 L' E
( N2 p% Q1 T8 e& m" IThe macromodeling technique used in the electrical and electromagnetic modeling and simulation of complex interconnects in three-dimensional integrated systems
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The semi-analytical scattering matrix method based on the N-body scattering theory for modeling of three-dimensional electronic package and multilayered printed circuit boards with multiple vias
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Two- and three-dimensional integral equation methods for the analysis of power distribution networks in three-dimensional package integrations3 E3 w8 f0 L/ y9 i x! V
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The physics-based algorithm for extracting the equivalent circuit of a complex power distribution network in three-dimensional integrated systems and printed circuit boards
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2 q! F3 d( X9 |" l1 @An equivalent circuit model of through-silicon vias! x Y. S9 w" o$ T# g8 o. h3 f
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Metal-oxide-semiconductor capacitance effects of through-silicon vias
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0 \3 \$ w; U, Y7 }Engineers, researchers, and students can turn to this book for the latest techniques and methods for the electrical modeling and design of electronic packaging, three-dimensional electronic integration, integrated circuits, and printed circuit boards.
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9 b! z4 `8 n/ m1 k" ~$ Q$ ~9 ^3D封装和多层电路板是作者研究的对象，S参数、PDN仍然是难点，如何对这些复杂的系统进行建模是研究重点。对于TSV这种新兴的封装技术的研究对于工程人员来说则有极大的参考价值。( r7 }# D8 f* Q! E8 K
; C: E. t; L" ^+ m可惜该书目前只有英文版，还未译成中文。全书的主要内容有5章，第一章是概述。; v& y7 v* s' w9 h8 O9 B
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发表于 2012-12-5 19:44
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发表于 2014-10-16 14:35
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