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本帖最后由 tsmephisto 于 2009-11-23 17:35 编辑
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5 a/ p0 n$ M4 q9 g. r有一个BGA芯片,Datasheet要求使用SMD焊盘:
c9 s& |8 Q3 n7 h. z( s. dAs shown in these figures, the PCB should be designed with large copper power planes and SMD (Solder Mask Defined) openings for BGA ball lands and LGA lands, instead of NSMD (Non Solder Mask Defined) pads. The use of SMD pads will rovide he best thermal and electrical performance while exceeding all reliability requirements. Figure 3 shows the differences between SMD pads and NSMD pads.
+ F6 P4 t0 {9 L0 G9 x这段文字的大意是,为了提高系统的热稳定性,建议使用大的铜焊盘和小的阻焊层开孔,即使用SMD(Solder Mask Defined)焊盘,但是,我找了很久,也没找到如何设置这样的焊盘。请高手指教!
2 `0 M4 R7 |6 q2 G4 ?1 A* X5 U- ]' a谢谢!) |" L, b4 a: a
% G+ `8 `3 g- `; Y7 C8 ?附件是SMD和NSMD的区别的示意图,请参照。 |
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