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看到英文解释:Bond fingers are pad stacks that are used in Package Designs (Allegro Package Designer). These 'fingers', which are single layer pads, allow you to add a wire from a die to a finger. From the bond finger to other pins in the package, such as a BGA, you would use traces/clines just as you do in Allegro Editor to connect pins of packages.
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; ]; Y7 N6 s; ~4 P& ]" Q$ x但不是很理解。求解释。4 J9 [2 X. Q" n* J
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