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1 逻辑电平的基本组成单元-三极管、MOS 管及其开关特性........................................... 5. Q8 Z2 {9 h' m) z
1.1 半导体三极管及其开关特性..................................................................................... 58 I' Q( z$ C! V$ o2 n
1.2 MOS 管的开关特性......................................................................................................7$ d& e$ Z5 {7 U7 B, Z* B' ~" m
2、逻辑电平简介.................................................................................................................... 8" X; [' \# y8 w& N
3、TTL 器件和CMOS 器件的逻辑电平............................................................................ 10
6 g; P& \' M1 R' z3.1:逻辑电平的一些概念............................................................................................... 10
5 D- d" E2 U$ j3 l4 l3.2:常用的逻辑电平....................................................................................................... 11
& h5 u6 D }3 H8 F: I/ L( }) X3.3:TTL 和CMOS 的逻辑电平关系.................................................................................. 112 ]% t k( ]: d9 g0 _
4、TTL 和CMOS 逻辑器件.................................................................................................... 132 ^) M. m4 R' m3 c
4.1:TTL 和CMOS 器件的功能分类.................................................................................. 13
. u" x5 b8 |. U( Y* B3 P4.2:TTL 和MOS 逻辑器件的工艺分类特点....................................................................13
$ ]- _+ y) V( V7 A8 M4.3:TTL 和CMOS 逻辑器件的电平分类特点..................................................................13
) L- V5 U0 D6 [4.4:包含特殊功能的逻辑器件....................................................................................... 14+ Q% o' E# N" g8 l1 P
4.5:逻辑器件的使用指南............................................................................................... 153 z* g, o+ }7 k" C7 L$ a% [+ g$ b# }
5、TTL、CMOS 器件的互连.................................................................................................. 16- ?: h S1 c( C( m0 A5 V5 `; f% a
5.1:器件的互连总则.......................................................................................................16
1 I% M! ?0 Q3 ] M) |5.2:5V TTL 门作驱动源..................................................................................................19
+ f1 |0 k. I2 [, ^9 D5.3:3.3V TTL/CMOS 门作驱动源..................................................................................... 19: W. }* v/ c5 o m9 D! \) F( S* R
5.4:5V CMOS 门作驱动源................................................................................................ 19. I$ a1 [; Q7 ^5 I) R( [8 a, v
5.5:2.5V CMOS 逻辑电平的互连.................................................................................... 19
2 r) V7 z0 \: E# T7 ?) m6、ECL 器件的原理和特点................................................................................................... 20- E! w6 e. ~$ y# Q3 D: a0 ^
6.1:ECL 器件的原理........................................................................................................20
; O6 R! Y+ c% C- i" X6.2:ECL 电路的特性........................................................................................................219 B! H$ r8 k5 p) @0 V, i* ^1 h4 R
6.3:ECL 器件的使用原则................................................................................................ 22' E; ^( v( ^% h. K
7、GTL 器件的原理和特点................................................................................................... 23
' I2 |! a. x1 A- n" T; h- V6 e7.1:GTL 器件的特点和电平............................................................................................ 23
- b' B: c' K& L- C. \7.2:GTL 信号的PCB 设计................................................................................................ 245 p) ^% Y3 x7 m* g! \ u; I
7.3:GTL 信号的测试........................................................................................................25; E; D* `; C. T. N' W
7.4:GTL 信号的时序........................................................................................................25& T+ ^6 w, y0 J- ]: O
8 HSTL 电平......................................................................................................................... 25
+ {1 \4 r2 k$ Y1 ]( ~8.1 基本定义..................................................................................................................... 259 d6 y& J* k5 s Y5 d+ H5 X
1.2 HSTL 分类.................................................................................................................... 26
- m% F' V/ e/ j% t. S8.3 HSTL 特点及SSTL .....................................................................................................26
7 C& L% G/ @% d- w! J9 PECL、LVPECL 电平........................................................................................................... 27
0 L) _- T5 x- O1 f& w. M4 d9.1:PECL/LVPECL 器件的原理和特点............................................................................270 V8 n% O/ X! ~; `: m2 u! f
9.2. PECL/LVPECL 电平输出结构................................................................................... 27& S! \! V* u/ N/ m f" e
9.3 PECL/LVPECL 信号的输入输出门特点: ..................................................................29
$ M8 e6 i! j/ q% T, S" M$ x7 R10 CML 电平......................................................................................................................... 30, s z, A& o, ~5 m9 _
10.1. CML 接口输出结构............................................................................................... 308 X1 x# z% ~7 Y+ Q) {4 b
10.2 CML 接口输入结构...................................................................................................30
4 f9 u* M- y; c% b4 j10.3 CML 电平的输出门和输入门的特点: ....................................................................31
/ Y; t. S- Y" D11. LVDS 器件的原理和特点.......................................................................................... 32
$ Z2 |' Q) d5 e- r9 Q# ^9 N11.1:LVDS 器件简介........................................................................................................32; M% A; |; Z' ^& h+ k; o
11.2 LVDS 器件的工作原理.............................................................................................. 33
) x/ x4 P; y/ n( _- Y11.3 LVDS 输入输出结构.................................................................................................33
$ [+ U0 E5 Q9 l. L# w% W5 a E# F11.4 LVDS 电平的特点...................................................................................................35
. T l1 _0 U) c12. CML LVPECL LVDS 简单比较及互连......................................................................... 357 C5 Q# c; s* H/ X# ] D
12.1 CML LVPECL LVDS 简单比较..............................................................................35
3 P) W1 u+ |) Z" r- Z t% U12.2 CML LVPECL LVDS 的互连综述..........................................................................38: ~% u6 |& ~0 v% ~: K9 x) h6 ^
12.3 LVPECL 的互连........................................................................................................39
# F7 m6 H2 T- T4 N5 a0 ] w. g12.4 LVDS 的互连............................................................................................................44
5 b, [9 {: n/ }' |# C: x12.5 CML 的互连..............................................................................................................45
) ~% X$ x, ]" l1 H/ P5 I5 V' y" _. ~ H附录:.................................................................................................................................... 47
- h' ?! l' b% W, l8 h附录1. 集成TTL 与非门电路、OC 门电路及其特性..................................................... 47+ @# C5 c2 D. Z ^: i8 s
附录2. CMOS 门电路及其特点.................................................................................... 59
' V3 j' K# [$ ?& I8 |/ T! K; W+ w! m; e+ ?: }0 C) K! N, r
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