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另外我查了一下板厂的板材结构:
( d/ @2 B9 d1 h5 z. h4 Layer Board Stackup and Specifications :, S+ ~& p2 h: Q8 F0 }( _
1 oz copper (1.4 mil)' Y* _# y% B d* B1 p
6.7 mil prepreg: j3 Z+ P& h5 h1 c) r$ ^9 x
0.5 oz copper (0.7 mil)
: }" C9 r; c$ G! ]: P* s0 p# h 47 mil core1 _$ ^! P, X. x& m1 S! t
0.5 oz copper (0.7 mil)
8 a1 t4 z: a7 G9 V* ^$ \ 6.7 mil prepreg3 x1 }) R( P1 k
1 oz copper (1.4 mil)
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) z8 {; l- u# W; G) R$ PThe substrate for both the core and prepreg is FR408, with a dielectric constant of 3.66 at 1GHz。7 O3 `; P' W; J& u2 w
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这个没提到阻焊层的信息,我用si9000计算的差分100欧阻抗匹配的时候,是要(1)Edge-Counpled Surface Microstrip 1B ---不带阻焊层;还是(2)Edge-Coupled Coated Microstrip 1B --- 带阻焊层?' x$ ~: Z' }3 K) w7 x `& E! I* U
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