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IPC-2252射频/微波电路板设计指南
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IPC 2252射频微波电路板设计指南.pdf
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9 o- d$ c, w1 A7 O | 由IPC高速/高频委员会(D-20)的高速/高频设计任务组(D-21b)研究开发
" j+ _# v5 p$ S5 {, R+ U目录
& |' @1 Z/ J, w- ^. }" z1 概述(GENERAL)................................................................................................................................ 1) [2 }: x# \$ n0 I/ F
1.1 目的(Purpose)........................................................................................................................... 1- y1 i. j0 @: r1 ?8 u/ U. K
1.2 范围(Scope).............................................................................................................................. 1
4 j3 c$ `& [- q1.3 术语和定义(Terms and Definitions)......................................................................................... 1
$ K# L" O9 L6 U0 N2 应用文档(Application Documents) ..................................................................................................... 3+ {$ X: ]* w( b5 h& y
2.1 国际互联与封装协会(IPC) ...................................................................................................... 3
/ y" m. ~* a" p: X3 T. }2.2 美国测试与材料协会(American Society for Testing and Materials) ....................................... 34 {. e9 h9 t- N3 K. H0 h5 u
2.3 汽车工程师协会(Society of Automotive Engineers)................................................................ 3
: t A8 C8 D5 C& y9 Z3 e2.4 美国机械工程师协会(American Society of Mechanical Engineers) ....................................... 3. T1 s' ~! W `/ O1 }! @4 w8 u
2.5 国际标准化组织(International Organization for Standardization)........................................... 3+ q: R5 P4 W; J- D( u" o3 n
2.6 参考文档(Reference Information) ............................................................................................ 3
9 @5 l! c! o ]% \7 A; c3 设计考虑(DESIGN CONSIDERATIONS).......................................................................................... 3
! e9 F: Q7 \8 j3.1 最初输入(Initial Input).............................................................................................................. 3
5 P' _" C* g$ n8 y, i9 F+ V3.2 设计方案(Design Options)........................................................................................................ 3
2 R* Z: M& p/ I" I; Q3.3 传输线类型，材料和元件(Transmission Line Type, Materials, and Components) ................ 33 W' H0 s$ E/ ]# M8 \6 c
3.4 电气设计(Electrical Design)..................................................................................................... 3
4 s# f, N8 h, e# H3.5 机械设计(Mechanical Design).................................................................................................. 3
; R n& W8 X4 w1 n& h9 _3.6 设计预审(Preliminary Design Review) .................................................................................... 36 t6 Z4 B [2 Z) Z
3.7 电路实验板(Breadboard).......................................................................................................... 3
, m. R5 `* E4 M! V8 }2 z3.8 原型(Prototype)........................................................................................................................ 3
. Q/ \) N% P/ C3 \+ B; a" s3.9 文件编制(Documentation)........................................................................................................ 3& ?( y! V- t) {8 S: y6 e
3.10 最终设计评审(Final Design Review)..................................................................................... 3
; j3 C4 Y% |6 h* {4 文档要求(DOCUMENTATION REQUIREMENTS) ......................................................................... 5
1 S9 I% H5 v. K9 y( M+ D4.1 产品特性列表(Design Features Listing) .................................................................................. 5
4 B! Q7 b2 a: b/ Z# |" g4.2 原图(Master Drawing) .............................................................................................................. 5) ^" G5 u. h# F/ `$ `2 ]" g7 L
4.3 原始图形(Master Pattern) ......................................................................................................... 57 D* k& z, x/ v* p% v" ]
5 材料(MATERIALS)............................................................................................................................ 5
$ {* x: F5 e! E |5.1 微波印制电路板材料(Microwave Printed Circuit Board Materials) ....................................... 5
) d4 |' N! T( ^5.1.1 基材选择(Substrate Selection)....................................................................................... 5& ~0 S8 `3 o0 M q
5.1.1.1 相对介电常数(Relative Permittivity) ................................................................. 5
! x9 ?( `- X/ T6 F. a/ _7 M5.1.1.2 损耗正切(Loss Tangent) ..................................................................................... 6
1 F9 O# A# P& j. y( {# x5.1.1.3 厚度(Thickness) .................................................................................................. 6
- ^# t& d0 V0 `# c, a0 j+ w5.1.1.4 环境(Environment).............................................................................................. 7
) }0 h$ `. F5 ^5.1.1.5 成本(Cost) ........................................................................................................... 72 x0 D- {! c0 H# Q' j! b; I+ C
5.1.1.6 供应商(Supplier) ................................................................................................. 7' G2 F% o' |3 s5 x
5.2 粘接膜(Bonding Films)............................................................................................................. 7, @, E6 V' S% D% j; ?6 X
5.2.1 热塑性粘接膜(Thermoplastic Bonding Films).............................................................. 7
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July 2002 [, U5 T2 p8 q; m b
5.2.2 热固性粘接膜(Thermoset Bonding Films) .................................................................... 7. M3 p! G' _8 W, K- ]' Z
5.2.3 聚四氟乙烯粘接(PTFE Bonding Considerations) ......................................................... 8; B9 ` x5 o: \5 ]
5.3 金属(Metals)............................................................................................................................. 8
" M8 |( P" M" r5.3.1 金属覆层(Cladding) ....................................................................................................... 8) R, U6 @/ ^) S1 q$ V
5.3.1.1 薄金属覆层(Thin Cladding Considerations)....................................................... 8# t' `5 Q9 N) ~
5.3.1.2 重磅金属覆层(Heavy Cladding Considerations) ................................................ 8' J8 F6 c9 D3 q/ J2 j) `
5.3.2 金属镀层(Metal Plating) ................................................................................................ 8# \5 v% q, F( }2 s! Z+ Y. z5 {5 F
5.3.2.1 准备金属化的孔和边缘(Preparing Holes and Edges for Plating)...................... 9 j( g3 Y% T7 p9 D
5.3.2.2 电镀铜(Electrodeposited Copper) ....................................................................... 9% k* Y: @+ w, i" h( @
5.3.2.3 镀镍(Nickel) ........................................................................................................ 9! |6 P/ `' T- g6 Q( |: G; S
5.3.2.4 镀金(Gold)........................................................................................................... 9
( @- ]/ ?& s+ D$ E' Q, k+ E0 H; F5.3.2.5 镀银(Silver) ......................................................................................................... 91 e0 f: v/ T. a+ u
5.3.2.6 镀锡-铅(Tin-lead) ................................................................................................ 9* A, D* s) }& ~ z5 V l+ q
5.3.2.7 焊料镀层Solder Coating...................................................................................... 9
7 M2 L5 h3 r) D! p. e/ h5.3.2.8 浸锡(Immersion Tin) ........................................................................................... 9
/ O7 y9 Q! ~* p- W5.3.2.9 电镀锡(Electroplated Tin) ................................................................................... 9% C* N* X4 {- K6 T% E) R
5.3.3 电化腐蚀(Galvanic Corrosion)....................................................................................... 9
/ f6 l" w1 c+ b. V6 I4 Z5.3.4 铬转换镀层(Chromate Conversion Coating) ............................................................... 10
0 s% z" I, a) v/ }6 G5.4 仿型涂层(Conformal Coating)................................................................................................ 104 a# R' `- `7 v0 e5 p R
5.4.1 一般注意事项(General Caution).................................................................................. 10) [8 j% Z0 h5 f& {/ L- o
5.4.2 聚四氟乙烯(PTFE Considerations).............................................................................. 10, w# ?( ^6 m3 r5 g4 ~2 u: _* M6 v) j
6 电气特性(ELECTRICAL CHARACTERISTICS) ............................................................................ 10
- d f; r u6 m6.1 带状线(Stripline) ..................................................................................................................... 11
% G9 x/ M% q0 ? [2 {* u, d6.1.1 带状线的特性阻抗(Characteristic Impedance of Stripline)......................................... 11
/ _% K. q& w6 X0 @+ F1 L) s$ A6.1.1.1 窄信号线(Narrow Signal Lines)........................................................................ 11
6 b. K. X( f! U" Q" w5 h6.1.1.2 宽信号线(Wide Signal Lines) ........................................................................... 12
+ z' m! B& x# o% b& x+ R6.1.2 带状线的衰减(Attenuation in Stripline) ...................................................................... 124 O+ R3 K3 d' D* I
6.1.2.1 窄信号线(Narrow signal lines).......................................................................... 12
, L2 v$ D0 y; N; r6 q0 q6.1.2.2 宽信号线(Wide signal lines) ............................................................................. 128 ]! u/ A5 N! C
6.2 非对称带状线(Asymmetric Stripline)..................................................................................... 13
" i# i8 n$ a6 e) j* ]8 c- H6.3 微带线(Microstrip) .................................................................................................................. 13
1 I8 S5 U8 Z% y. U$ c6.3.1 微带线的特性阻抗和有效相对介电常数(Characteristic Impedance and Effective
8 l2 C% Z$ R1 @1 w% s- h7 t7 ?Permittivity f Microstrip)................................................................................................................ 13
$ I$ [. d4 W7 X# G0 I l6.3.2 微带线的衰减(Attenuation in Microstrip) ................................................................... 15+ f$ R! }5 e: b' g# [9 j7 G
7 板的详细要求(TAILED BOARD REQUIREMENTS) ..................................................................... 15* S* V2 A0 U/ e* g
7.1 机械特性(Machined Features) ................................................................................................ 15
/ p4 i3 q; K/ P6 C* F6 B: w7.1.1 尺寸和公差(Dimensioning and Tolerancing)............................................................... 15
" x9 X2 L6 Y4 g* d3 _7.1.2 金属化过孔(Plated-Through Holes)............................................................................. 16
9 E) a" q# Q2 {* P' ?4 t" M7.1.2.1 销针/接地(Pinning/Ground Connections) ......................................................... 17: L$ I C6 r- c! h: L9 K
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, G; @9 C( k* z7.1.3 非金属化孔(Unplated Holes)....................................................................................... 17$ w. ^ Y# i+ E6 Y0 M' J+ m
7.1.4 深度腔和槽(Depth Pockets and Slots)......................................................................... 18
# L: a) d6 _! x5 ]) W% g" n A! }7.1.5 内层接口加工(Inner-Layer Access Machining) .......................................................... 18
& P' J9 C' D0 i7.1.6 外形(Periphery)............................................................................................................ 18& M- t& c0 G/ u+ q6 ~4 E6 x6 A
7.1.7 数控(NC)设备[Numerically Controlled (NC) Equipment].......................................... 18. N6 @# s+ A) c
7.1.8 尺寸检查(Dimensional Inspection).............................................................................. 18
# d" @0 l3 j& n; h7.2 出图(Imaging) ......................................................................................................................... 18
: }0 }, | q6 n/ `6 I- b( d7.2.1 底片(Artwork).............................................................................................................. 19
3 y/ t: w/ S$ s1 a& Y7.2.2 光致抗蚀剂(Photoresist).............................................................................................. 196 B- B9 T" ?- v4 ^ {6 x
7.2.3 环孔(Annular Rings) .................................................................................................... 19& P9 \3 @! B, o7 ^5 J: u
7.3 PTFE活化(PTFE Activation) ................................................................................................... 192 o6 A) |7 Z5 d3 D7 t, t4 Y9 D
7.4 金属化(Metallization) ............................................................................................................. 19
: h9 g- V) `' f3 G7.4.1 边缘金属化设计(Plated Edge Designs)....................................................................... 19
( v$ r7 u, x7 y0 n7.4.2 镀铜(Copper Plating) ................................................................................................... 19
0 C* W- c0 b5 i! A6 R& M- S7.5 蚀刻(Etching) .......................................................................................................................... 20
: G# J* _' z& c# s9 d: K7 `& h0 m7.6 粘接(Bonding)........................................................................................................................ 20' _/ b/ W: F4 @' T+ }
7.7 多种材料多层(Multiple Material Multilayers)....................................................................... 21
* V' B0 ?3 p, b- Q, N- D1 L2 L; Z0 j7.8 测试(Testing).......................................................................................................................... 216 S& \" I) d- I* b2 y
8 器件固定和封装(DEVICE ATTACHMENTS AND PACKAGING)................................................ 217 \) x+ {4 ? I6 \0 {5 T
8.1 将电路安装在腔体（Attaching the Circuit to the Housing） ............................................... 219 w- H# K( D6 c9 i8 c+ b) P \
8.1.1 机械固定（Mechanical Mounting）........................................................................... 21
6 h. l9 Z+ r/ m8.1.1.1 聚四氟乙烯（PTFE Considerations） ............................................................. 21* Q) ]! V3 U& Q( I% b
8.1.2 环氧树脂（导电和绝缘的）[Epoxies (both conductive and nonconductive)]........... 21- n+ D- _" s, B; ] }6 n, c" Y
8.1.3 热塑性膜（Thermoplastic Films） ............................................................................. 22
; D* p3 y0 Y/ _3 ?; O' z8.1.4 软钎焊（Soldering）................................................................................................... 22
: g' c2 M* y: A2 ?8 @# O8.1.4.1 温度警示（Temperature Caution）.................................................................. 22& C ?3 O& X, q% v
8.1.5 直接粘结（Direct Bonding）...................................................................................... 22; U/ E+ u4 N9 g0 G% `% f
8.2 连接器安装（Connector Attachment） ................................................................................. 22+ ~, h: S( y ^7 s0 q% ~3 ]; u6 k
8.2.1 边缘连接器（Edge Connector） ................................................................................ 22
" L3 n, P8 q$ X& M1 J) X6 u9 P8.2.2 表面连接器（Surface Connector） ............................................................................ 23
' Q$ p4 ]* F7 f' u9 Z- P5 c8 j8.3 器件安装（Device Attachment）........................................................................................... 23
& V) E2 w, V+ ?# _( f- E/ N2 `/ |8.3.1 焊接连接（Welded Bonds）....................................................................................... 23
, x8 H0 Z: |3 Q3 F5 i8.3.1.1 电阻焊接（Resistance Welding）.................................................................... 23
" z' ~* p- Z1 p( V: ]+ \8.3.1.2 平行间隙焊接（Parallel Gap Welding） ......................................................... 23; N4 v4 A' [) F: Y
8.3.1.3 电弧储能焊（Percussive Arc Welding） ......................................................... 24
; Z8 p! j7 y5 i' T( g5 o8.3.1.4 激光焊接（Laser Welding） ............................................................................ 241 q8 [( M& Y1 n7 F
8.3.1.5 软钎焊（Soldering）........................................................................................ 248 s( B8 x8 @$ U
8.3.2 扩散粘结（Diffusion Bonding） ................................................................................ 24
) [& R- E+ L$ h, m) m, H8.3.2.1 超声波焊接（Ultrasonic Welding） ................................................................ 24
9 L7 \/ B! s2 _0 N* @III. E# k& T* h5 X8 U: c. H
July 2002
+ _% G$ P7 D* D4 K, D8.3.2.2 热压焊（Thermal Compression Bonding） ..................................................... 24* s" V' ^! @$ o* @6 l/ v7 w7 P
8.3.2.3 超声热压焊接（Thermosonic Bonding）........................................................ 24
- K% V8 G$ t. i! A7 l7 Z2 H$ n$ v8.3.3 器件安装（Device Attachment）................................................................................ 244 K# M$ i/ n$ V( K1 w
8.3.3.1 超声波丝焊（Ultrasonic Wire Bonding）........................................................ 24
/ Y; u& ], `: ~3 B+ V* K- m) G8.3.3.2 超声热（球）焊[Thermosonic (Ball) Bonding] ............................................... 25
\% o1 k: f; H% S1 o* a+ I! { N8.3.3.3 平行间隙焊接（Parallel Gap Welding）.......................................................... 25) e* O" N7 `/ j, D
8.3.3.4 热压键合（Thermal Compression Bonding） ................................................. 25
/ l1 N& [5 A' B3 v/ M8.3.3.5 再流焊（Solder Reflow）................................................................................. 25
( {/ u7 N T2 |* |4 g! ]$ [- s9 质量保证（QUALITY ASSURANCE） .......................................................................................... 25! u% [5 u9 X: ~' o
9.1 质量一致性鉴定（Quality Conformance Evaluations） ....................................................... 25
1 B1 S3 }4 h5 O: H7 l9.2 可靠性（Reliability）............................................................................................................. ; c) }. ^: e4 ^- p5 D2 f
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发表于 2010-11-30 12:42
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