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IPC-2252射频/微波电路板设计指南
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IPC 2252射频微波电路板设计指南.pdf
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! N0 Y: {# H; q: D* M+ d7 ` B | 由IPC高速/高频委员会(D-20)的高速/高频设计任务组(D-21b)研究开发- {6 k8 c: f: z' `
目录
. d a. O4 W, g7 c4 X1 概述(GENERAL)................................................................................................................................ 1
6 d$ _; M9 ^! j8 S1.1 目的(Purpose)........................................................................................................................... 1
0 m# Y& m/ E0 c3 r1.2 范围(Scope).............................................................................................................................. 1: u. Y7 r% h4 X% V) `' q" |; f
1.3 术语和定义(Terms and Definitions)......................................................................................... 15 R( g: O) r4 ?9 S
2 应用文档(Application Documents) ..................................................................................................... 3
; y. Y2 f2 T: I, N2.1 国际互联与封装协会(IPC) ...................................................................................................... 3$ U) ^: c% ?( N( z# k1 @/ G
2.2 美国测试与材料协会(American Society for Testing and Materials) ....................................... 3
) F3 w1 }/ R: |( Q, E; ~( |4 e5 ]2.3 汽车工程师协会(Society of Automotive Engineers)................................................................ 3' q/ ?6 E" J% Z9 S6 A S$ [
2.4 美国机械工程师协会(American Society of Mechanical Engineers) ....................................... 3) t9 ~( X# M- v& ^. j9 Y
2.5 国际标准化组织(International Organization for Standardization)........................................... 3* y" r9 H7 F# C( T
2.6 参考文档(Reference Information) ............................................................................................ 3
. j5 H8 F6 [$ {- P3 设计考虑(DESIGN CONSIDERATIONS).......................................................................................... 3
3 K9 h2 B8 ^* D# ~: x! d3.1 最初输入(Initial Input).............................................................................................................. 3
% [: h9 R8 s9 \* ~3.2 设计方案(Design Options)........................................................................................................ 3
# G) S) L- [( }+ Y; b6 ]+ H3 x* }3.3 传输线类型，材料和元件(Transmission Line Type, Materials, and Components) ................ 38 Y* p2 k* ~8 ]8 X+ B; u8 O0 R0 }6 q7 W
3.4 电气设计(Electrical Design)..................................................................................................... 3
# ?- h6 d. y* W+ S2 w4 j5 o3.5 机械设计(Mechanical Design).................................................................................................. 3
: n: P4 E5 x% m! m5 R3.6 设计预审(Preliminary Design Review) .................................................................................... 3
- x, P1 b# S" `# K3.7 电路实验板(Breadboard).......................................................................................................... 3% t* {0 i& Y0 C2 r( A" o! o& x7 t4 O
3.8 原型(Prototype)........................................................................................................................ 31 H7 \, y9 Y8 m! t" `+ S
3.9 文件编制(Documentation)........................................................................................................ 34 o! [, ~6 |% B, O4 b
3.10 最终设计评审(Final Design Review)..................................................................................... 3
( G2 z5 M9 L9 l, O4 文档要求(DOCUMENTATION REQUIREMENTS) ......................................................................... 5
: Z1 g5 r$ X6 g& W8 V9 @3 Y4.1 产品特性列表(Design Features Listing) .................................................................................. 5
1 U: |# }5 T0 W7 }6 @ {2 P6 }/ N5 q4.2 原图(Master Drawing) .............................................................................................................. 51 A, Y/ \4 [# n) K
4.3 原始图形(Master Pattern) ......................................................................................................... 5& V) H/ T" Z) }& A, w1 N
5 材料(MATERIALS)............................................................................................................................ 5& h, e% ]" K5 F
5.1 微波印制电路板材料(Microwave Printed Circuit Board Materials) ....................................... 59 U/ D4 M3 Y6 j
5.1.1 基材选择(Substrate Selection)....................................................................................... 53 R! r" Y- n$ g& h
5.1.1.1 相对介电常数(Relative Permittivity) ................................................................. 5; Z/ t5 T7 t. W1 I8 A
5.1.1.2 损耗正切(Loss Tangent) ..................................................................................... 6
* v. b+ y" N h$ B, Z0 I4 b y3 f' [5.1.1.3 厚度(Thickness) .................................................................................................. 6
* l) f O/ Z/ h2 ?2 I# ?& K5.1.1.4 环境(Environment).............................................................................................. 7
! i" s3 k$ S" c/ d5.1.1.5 成本(Cost) ........................................................................................................... 7# t$ h. x8 z$ t2 e) V2 K
5.1.1.6 供应商(Supplier) ................................................................................................. 7( K* O" K! i7 l# Y1 B' w; c
5.2 粘接膜(Bonding Films)............................................................................................................. 74 q6 y2 I. l9 j7 I, z- [
5.2.1 热塑性粘接膜(Thermoplastic Bonding Films).............................................................. 7
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July 2002( D) g% x+ N0 ^* q0 A6 g8 m4 I
5.2.2 热固性粘接膜(Thermoset Bonding Films) .................................................................... 7; e# w% v8 |. a7 K! ^
5.2.3 聚四氟乙烯粘接(PTFE Bonding Considerations) ......................................................... 8* U! ~8 @7 b/ `( m
5.3 金属(Metals)............................................................................................................................. 8
; F5 v/ [% k+ N$ ^. |5.3.1 金属覆层(Cladding) ....................................................................................................... 88 ?, l) U6 E* w" K# h9 s% V2 p% E% }
5.3.1.1 薄金属覆层(Thin Cladding Considerations)....................................................... 8
7 y! L9 P1 T0 ~7 I# c; G U( N5.3.1.2 重磅金属覆层(Heavy Cladding Considerations) ................................................ 8
0 z7 Q3 u5 Z2 A5.3.2 金属镀层(Metal Plating) ................................................................................................ 8
- m. C" X% f' {0 |+ y$ k5.3.2.1 准备金属化的孔和边缘(Preparing Holes and Edges for Plating)...................... 9
2 Y5 U% G+ l2 f/ n5.3.2.2 电镀铜(Electrodeposited Copper) ....................................................................... 9
8 P. d$ ^% w. N3 n$ A+ q! o+ i5.3.2.3 镀镍(Nickel) ........................................................................................................ 9
6 m4 ^) h% s8 R. l. z! h' T6 m5.3.2.4 镀金(Gold)........................................................................................................... 9
- G- p( T- c4 _) y5.3.2.5 镀银(Silver) ......................................................................................................... 96 ]9 U) U5 @, b4 I& d X
5.3.2.6 镀锡-铅(Tin-lead) ................................................................................................ 9
/ K$ ]+ R6 c! G% Y P, R' w( m5.3.2.7 焊料镀层Solder Coating...................................................................................... 9; y1 I% i8 Q h0 L; y( \8 |" d
5.3.2.8 浸锡(Immersion Tin) ........................................................................................... 9
}0 D+ Z$ \3 R3 z# ]/ P5.3.2.9 电镀锡(Electroplated Tin) ................................................................................... 9! f) a) w" R! C1 x( p
5.3.3 电化腐蚀(Galvanic Corrosion)....................................................................................... 9
. M# W1 r5 }$ U- @! B5.3.4 铬转换镀层(Chromate Conversion Coating) ............................................................... 10
0 @/ i" _5 A% x% S5.4 仿型涂层(Conformal Coating)................................................................................................ 107 Z" w6 }4 O8 H8 a
5.4.1 一般注意事项(General Caution).................................................................................. 103 y4 l. ?5 T+ S" g/ L8 Z
5.4.2 聚四氟乙烯(PTFE Considerations).............................................................................. 10/ w' a( Q: S9 c2 `9 y
6 电气特性(ELECTRICAL CHARACTERISTICS) ............................................................................ 10
* u8 ?1 ]+ w4 Y, \7 Q- N6.1 带状线(Stripline) ..................................................................................................................... 11
4 U: i9 y3 Y- T. M6.1.1 带状线的特性阻抗(Characteristic Impedance of Stripline)......................................... 113 y) z. z. U7 m' n N
6.1.1.1 窄信号线(Narrow Signal Lines)........................................................................ 11
( A+ U6 z* v: z5 R4 P- S6 k0 Q6.1.1.2 宽信号线(Wide Signal Lines) ........................................................................... 12
/ Q5 n( O- r! d$ h6 ]" S6 y6.1.2 带状线的衰减(Attenuation in Stripline) ...................................................................... 12
/ z2 \- h6 t& h! G& c% k$ t6.1.2.1 窄信号线(Narrow signal lines).......................................................................... 12 q$ l- Y# \( N' k
6.1.2.2 宽信号线(Wide signal lines) ............................................................................. 12: _" Z! G* y# |+ n A5 y" k, m
6.2 非对称带状线(Asymmetric Stripline)..................................................................................... 135 l' L- _( T; V: l) D
6.3 微带线(Microstrip) .................................................................................................................. 13. |1 C8 h; i' }% o! _ e
6.3.1 微带线的特性阻抗和有效相对介电常数(Characteristic Impedance and Effective6 Y4 W7 N- R' D' Z7 D* |
Permittivity f Microstrip)................................................................................................................ 13
$ \7 U5 F% h! h3 J" F6.3.2 微带线的衰减(Attenuation in Microstrip) ................................................................... 15- J# U# F4 r& T2 ?
7 板的详细要求(TAILED BOARD REQUIREMENTS) ..................................................................... 15, E% Z6 y' n/ W* b( J; c/ d
7.1 机械特性(Machined Features) ................................................................................................ 158 S5 r/ w" H& ~3 }, y" t
7.1.1 尺寸和公差(Dimensioning and Tolerancing)............................................................... 156 W- M; _0 U3 n) `6 d
7.1.2 金属化过孔(Plated-Through Holes)............................................................................. 16/ D9 M/ N2 W. x: _
7.1.2.1 销针/接地(Pinning/Ground Connections) ......................................................... 17! z6 C) b2 j2 ~) Z' Y4 v4 T8 h* x" Y
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IPC-2252
$ |. f( {+ A0 _9 f9 a1 a8 j; B* g! k- a7.1.3 非金属化孔(Unplated Holes)....................................................................................... 17
0 E2 B0 z+ Y) J/ h# s0 Q7.1.4 深度腔和槽(Depth Pockets and Slots)......................................................................... 18
5 _; P- T( f: V. \/ R7.1.5 内层接口加工(Inner-Layer Access Machining) .......................................................... 18
: Z6 Q( J2 s1 }2 P( B' G7.1.6 外形(Periphery)............................................................................................................ 18
5 n0 e1 |% t' K! b9 M, i0 o7.1.7 数控(NC)设备[Numerically Controlled (NC) Equipment].......................................... 18+ J0 o& I* V4 n8 \9 E, N
7.1.8 尺寸检查(Dimensional Inspection).............................................................................. 18
$ o( x% u9 T6 ]0 S2 v7.2 出图(Imaging) ......................................................................................................................... 187 x3 h: T8 [$ ^8 l; z
7.2.1 底片(Artwork).............................................................................................................. 19
6 L- ]& `6 P! L1 U7 [9 s8 l: q' p7.2.2 光致抗蚀剂(Photoresist).............................................................................................. 19( `, R7 k) m4 L- d6 d1 Z1 h. m
7.2.3 环孔(Annular Rings) .................................................................................................... 19; X2 |6 ]& \, |) i- L
7.3 PTFE活化(PTFE Activation) ................................................................................................... 19
+ C" _3 D/ D' E4 v ^6 N7.4 金属化(Metallization) ............................................................................................................. 19
5 g) ]4 j+ S v- q7.4.1 边缘金属化设计(Plated Edge Designs)....................................................................... 19; T( i6 D- O" j& I5 e5 C# J* [4 t
7.4.2 镀铜(Copper Plating) ................................................................................................... 19
7 g9 {7 g' K9 F5 h- E7.5 蚀刻(Etching) .......................................................................................................................... 20
) X" ~) V) V- M; d' h5 n, w) G7.6 粘接(Bonding)........................................................................................................................ 208 o# a3 V4 v1 ^
7.7 多种材料多层(Multiple Material Multilayers)....................................................................... 21
4 A2 @" N: S7 Z9 N& l* w! `7.8 测试(Testing).......................................................................................................................... 213 m* I- o4 ^' v/ {* t1 K5 q
8 器件固定和封装(DEVICE ATTACHMENTS AND PACKAGING)................................................ 21
1 [0 y) |* b# Z( t; d5 V5 y8.1 将电路安装在腔体（Attaching the Circuit to the Housing） ............................................... 21
$ s, d; a3 L- D8.1.1 机械固定（Mechanical Mounting）........................................................................... 21
: j% t5 X8 S) w+ c8.1.1.1 聚四氟乙烯（PTFE Considerations） ............................................................. 21
: z/ K0 ^4 B6 g+ L8.1.2 环氧树脂（导电和绝缘的）[Epoxies (both conductive and nonconductive)]........... 21
2 y1 t) ]* L: X$ e% ~: \. _8.1.3 热塑性膜（Thermoplastic Films） ............................................................................. 22 m. { H! l4 c+ O, y& q+ l
8.1.4 软钎焊（Soldering）................................................................................................... 22
5 p+ [2 u1 T+ r8.1.4.1 温度警示（Temperature Caution）.................................................................. 22* t1 _( @( a+ w1 A6 L
8.1.5 直接粘结（Direct Bonding）...................................................................................... 228 Z6 B! ?6 B, B
8.2 连接器安装（Connector Attachment） ................................................................................. 22
4 j( s. q' _- P6 ]! n8.2.1 边缘连接器（Edge Connector） ................................................................................ 222 ]- ]$ n, F8 d5 o5 s7 ^3 c/ ?
8.2.2 表面连接器（Surface Connector） ............................................................................ 235 b2 l# D8 ?4 Q
8.3 器件安装（Device Attachment）........................................................................................... 23
5 P. Y3 a' m5 Y% t1 r8.3.1 焊接连接（Welded Bonds）....................................................................................... 233 e: A3 ~9 d* d
8.3.1.1 电阻焊接（Resistance Welding）.................................................................... 23
$ z! D; z) s( N( i) I8.3.1.2 平行间隙焊接（Parallel Gap Welding） ......................................................... 23/ T1 G7 |& @/ k; c# |5 A* }) ~
8.3.1.3 电弧储能焊（Percussive Arc Welding） ......................................................... 24
7 P0 t, U# i2 r1 F8.3.1.4 激光焊接（Laser Welding） ............................................................................ 24
" `: S# U4 y- A7 K# `2 T8.3.1.5 软钎焊（Soldering）........................................................................................ 24
9 Y9 W1 ?% D _, S S& V& {1 H* M- {: z8.3.2 扩散粘结（Diffusion Bonding） ................................................................................ 24: T5 s! o b) K4 m8 V8 T
8.3.2.1 超声波焊接（Ultrasonic Welding） ................................................................ 24
: C% I5 p& G5 l6 VIII
. b3 V* G! o* B# j8 z: HJuly 2002
8 E- w: D) p3 y4 ^5 l# K8.3.2.2 热压焊（Thermal Compression Bonding） ..................................................... 24, k( R6 q( L( M: k. b
8.3.2.3 超声热压焊接（Thermosonic Bonding）........................................................ 24
9 | z4 ~8 @2 ~! C5 ]8.3.3 器件安装（Device Attachment）................................................................................ 24
4 w0 d& ]! l6 `' i8 H8.3.3.1 超声波丝焊（Ultrasonic Wire Bonding）........................................................ 241 D I R& e2 G+ k3 L( `! @ \
8.3.3.2 超声热（球）焊[Thermosonic (Ball) Bonding] ............................................... 25) r- N3 E% S' O" g, W) c6 q: Y! q
8.3.3.3 平行间隙焊接（Parallel Gap Welding）.......................................................... 25
4 v* \) R1 A- b ~; Q8.3.3.4 热压键合（Thermal Compression Bonding） ................................................. 25' P# r% r# P/ G' n/ G. [
8.3.3.5 再流焊（Solder Reflow）................................................................................. 25
0 `8 S2 J5 L) @" e9 G9 质量保证（QUALITY ASSURANCE） .......................................................................................... 25- J! p7 Y7 L7 t7 h
9.1 质量一致性鉴定（Quality Conformance Evaluations） ....................................................... 257 }3 H, w$ n! w: H
9.2 可靠性（Reliability）.............................................................................................................
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发表于 2010-11-30 12:42
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