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IPC-2252射频/微波电路板设计指南
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IPC 2252射频微波电路板设计指南.pdf
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' X/ V, r+ M! ` t! A+ C# b! v# b+ [. H | 由IPC高速/高频委员会(D-20)的高速/高频设计任务组(D-21b)研究开发
) o: Z3 c/ b2 y! q目录
0 P. I( v" u/ z8 l( Q* G1 概述(GENERAL)................................................................................................................................ 1! z$ r* ~: Q* |% b
1.1 目的(Purpose)........................................................................................................................... 1
- B+ _9 d6 N; o1.2 范围(Scope).............................................................................................................................. 1$ A; ~3 P2 D0 h+ C0 b' q
1.3 术语和定义(Terms and Definitions)......................................................................................... 1
7 f3 X! J* x( |3 ]2 N }% D, y2 应用文档(Application Documents) ..................................................................................................... 3
0 _( V, R: h+ A2.1 国际互联与封装协会(IPC) ...................................................................................................... 3
2 t9 o' B- r# B; R; f% X, W) c: Y2.2 美国测试与材料协会(American Society for Testing and Materials) ....................................... 37 \- b+ f0 G& k0 v
2.3 汽车工程师协会(Society of Automotive Engineers)................................................................ 3
$ k7 t+ ]# j+ a) z$ e2.4 美国机械工程师协会(American Society of Mechanical Engineers) ....................................... 3
* H: o7 Q9 u3 K) y& {* @" d" P2.5 国际标准化组织(International Organization for Standardization)........................................... 3' u$ c/ p0 P& c
2.6 参考文档(Reference Information) ............................................................................................ 3
( \1 V2 E, x6 i" | X( V; S3 设计考虑(DESIGN CONSIDERATIONS).......................................................................................... 33 J7 t+ \5 n2 ]$ q" K
3.1 最初输入(Initial Input).............................................................................................................. 3
( f+ B* I }8 D7 e! O+ Y3.2 设计方案(Design Options)........................................................................................................ 3$ z; f8 ~, p) u9 }
3.3 传输线类型，材料和元件(Transmission Line Type, Materials, and Components) ................ 3
+ v5 `- ]2 v9 v3.4 电气设计(Electrical Design)..................................................................................................... 3! f& v, m, B* I- N( @# @
3.5 机械设计(Mechanical Design).................................................................................................. 3, m1 M5 b0 g# v! \
3.6 设计预审(Preliminary Design Review) .................................................................................... 3
9 F0 z. b$ E) ]0 M* j3.7 电路实验板(Breadboard).......................................................................................................... 3
. x% u& ~; f. ^3 v, f3.8 原型(Prototype)........................................................................................................................ 3
6 t' R7 @0 ]! d3.9 文件编制(Documentation)........................................................................................................ 3
0 G( G+ A" R+ M' P8 x3.10 最终设计评审(Final Design Review)..................................................................................... 3
, r; R5 H9 x$ h- m, v8 P$ w4 文档要求(DOCUMENTATION REQUIREMENTS) ......................................................................... 5( D( n& q6 T* J& i. ?9 u8 O& |
4.1 产品特性列表(Design Features Listing) .................................................................................. 5
9 \ v. _) D t2 o' P( d& D4.2 原图(Master Drawing) .............................................................................................................. 5: @3 \3 Z7 L4 z
4.3 原始图形(Master Pattern) ......................................................................................................... 5
Q2 \6 ]+ n0 k: T5 材料(MATERIALS)............................................................................................................................ 5) k; w2 Q3 I3 ]1 i$ K: x
5.1 微波印制电路板材料(Microwave Printed Circuit Board Materials) ....................................... 5
0 @# t% d( Z. y5.1.1 基材选择(Substrate Selection)....................................................................................... 5
" c5 M7 ~ h6 V! f/ x4 j5.1.1.1 相对介电常数(Relative Permittivity) ................................................................. 5# |- _" I* ]; d) S, Y% n
5.1.1.2 损耗正切(Loss Tangent) ..................................................................................... 6
0 i- \! p/ P% G9 z) l5.1.1.3 厚度(Thickness) .................................................................................................. 6. V- Z, x2 m* H- g
5.1.1.4 环境(Environment).............................................................................................. 77 ]# e; ]# W: x& R
5.1.1.5 成本(Cost) ........................................................................................................... 7
6 H1 g, o" b0 t7 \5.1.1.6 供应商(Supplier) ................................................................................................. 7% `# W i: c% j4 \
5.2 粘接膜(Bonding Films)............................................................................................................. 7" O" `8 n M m# { @5 \
5.2.1 热塑性粘接膜(Thermoplastic Bonding Films).............................................................. 7. c# M, Y5 K+ u% n6 g( d" u5 _9 w
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# W( s8 m* Y% [& k, p! J8 ?5.2.2 热固性粘接膜(Thermoset Bonding Films) .................................................................... 7$ A5 g( f9 E! v( X3 q
5.2.3 聚四氟乙烯粘接(PTFE Bonding Considerations) ......................................................... 8; i. \8 I( j0 r7 p& M l. Q6 w! O
5.3 金属(Metals)............................................................................................................................. 8
! Q, x5 F6 [4 ?& R! }$ {5.3.1 金属覆层(Cladding) ....................................................................................................... 8
! j: g, E: x* |: k( _' k+ Q+ B5.3.1.1 薄金属覆层(Thin Cladding Considerations)....................................................... 8
% ~0 ^* L3 }: P t# n* }5.3.1.2 重磅金属覆层(Heavy Cladding Considerations) ................................................ 8
4 B4 u8 b/ o! S: j" d, n" H" \ A" V5.3.2 金属镀层(Metal Plating) ................................................................................................ 8* s# z1 [9 M! N/ S0 u* j! V' X; q
5.3.2.1 准备金属化的孔和边缘(Preparing Holes and Edges for Plating)...................... 9
! ^7 S' N. g( A4 `" ]0 R! q# b5.3.2.2 电镀铜(Electrodeposited Copper) ....................................................................... 9
. C* \3 t( W) Q8 r* V5.3.2.3 镀镍(Nickel) ........................................................................................................ 9
3 E! j! [+ S) c; w4 O& p& z( G5.3.2.4 镀金(Gold)........................................................................................................... 9
0 Z4 Z' D5 |6 ?/ \5.3.2.5 镀银(Silver) ......................................................................................................... 9
; `) O( m; ^ G/ X b/ |5.3.2.6 镀锡-铅(Tin-lead) ................................................................................................ 9
. E9 t' K6 @6 v Q1 y0 m5.3.2.7 焊料镀层Solder Coating...................................................................................... 9
$ Q" W, f9 _1 U) g8 C5.3.2.8 浸锡(Immersion Tin) ........................................................................................... 9
3 q% `; c- O n; s7 |5.3.2.9 电镀锡(Electroplated Tin) ................................................................................... 98 J ]7 l! N/ c) o1 Y9 B9 F8 _" ^
5.3.3 电化腐蚀(Galvanic Corrosion)....................................................................................... 9
& E. v7 @- O# Y5.3.4 铬转换镀层(Chromate Conversion Coating) ............................................................... 10
0 ~. X/ `3 q2 A5 z5.4 仿型涂层(Conformal Coating)................................................................................................ 10$ S2 I- t, L3 l& W, m) l
5.4.1 一般注意事项(General Caution).................................................................................. 10
) l# D1 {) b/ E. I% a5.4.2 聚四氟乙烯(PTFE Considerations).............................................................................. 10! C2 m1 Q! a# {0 [. H6 V9 y* J! I
6 电气特性(ELECTRICAL CHARACTERISTICS) ............................................................................ 10$ b( B# B" {6 ~$ j2 `
6.1 带状线(Stripline) ..................................................................................................................... 11
" P' H) v1 E4 i! G0 N# S d6.1.1 带状线的特性阻抗(Characteristic Impedance of Stripline)......................................... 11
; F( T6 Z; A& Z' I6.1.1.1 窄信号线(Narrow Signal Lines)........................................................................ 11
" k, ^# {2 V1 U6.1.1.2 宽信号线(Wide Signal Lines) ........................................................................... 12* X( a" w8 h- m) _4 N) _
6.1.2 带状线的衰减(Attenuation in Stripline) ...................................................................... 12
4 F, K3 P, ^1 G7 ^" O9 x9 c- E6.1.2.1 窄信号线(Narrow signal lines).......................................................................... 128 Z' F2 Y" e2 W
6.1.2.2 宽信号线(Wide signal lines) ............................................................................. 12
& q8 X8 f- _/ Y4 J( @6.2 非对称带状线(Asymmetric Stripline)..................................................................................... 13, l- T' ? `. {
6.3 微带线(Microstrip) .................................................................................................................. 13& F9 B# s9 Y6 d' c; X$ O3 I6 s
6.3.1 微带线的特性阻抗和有效相对介电常数(Characteristic Impedance and Effective& M, M* J$ D' u* v/ _
Permittivity f Microstrip)................................................................................................................ 137 X. g( T! r- o; C5 ^2 T3 K; C
6.3.2 微带线的衰减(Attenuation in Microstrip) ................................................................... 154 u2 ?; _( `1 Z4 X
7 板的详细要求(TAILED BOARD REQUIREMENTS) ..................................................................... 15
/ U) f% ?+ n1 L) _3 ~) A7.1 机械特性(Machined Features) ................................................................................................ 15# \1 I" @" I- l% u2 B
7.1.1 尺寸和公差(Dimensioning and Tolerancing)............................................................... 157 V4 n, }' w; x
7.1.2 金属化过孔(Plated-Through Holes)............................................................................. 16
. h: b8 M) H4 b/ F) ?7.1.2.1 销针/接地(Pinning/Ground Connections) ......................................................... 17+ E+ A! T2 a& H! A8 a/ Q
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7.1.3 非金属化孔(Unplated Holes)....................................................................................... 17
/ N! W4 G. G2 e+ b7.1.4 深度腔和槽(Depth Pockets and Slots)......................................................................... 18
2 J0 q: ~) A }; B7.1.5 内层接口加工(Inner-Layer Access Machining) .......................................................... 184 S8 I" K( W) c) [& _
7.1.6 外形(Periphery)............................................................................................................ 187 N3 E# b4 D; [9 e, e
7.1.7 数控(NC)设备[Numerically Controlled (NC) Equipment].......................................... 18
& v* O$ c0 ]: U7.1.8 尺寸检查(Dimensional Inspection).............................................................................. 18
* d" a# b6 r% T7 Q9 K# l! J7.2 出图(Imaging) ......................................................................................................................... 18; d# P9 M4 _8 G- P
7.2.1 底片(Artwork).............................................................................................................. 19
; B7 X/ p# Z* W/ N) _6 x$ }7.2.2 光致抗蚀剂(Photoresist).............................................................................................. 199 j; u5 @ F: x" b1 \- d5 X
7.2.3 环孔(Annular Rings) .................................................................................................... 19
" w6 {) f t3 n* A9 R7.3 PTFE活化(PTFE Activation) ................................................................................................... 190 _4 q' R8 l* u+ F
7.4 金属化(Metallization) ............................................................................................................. 19
. k1 O4 D- L. w+ t9 U; G1 P7.4.1 边缘金属化设计(Plated Edge Designs)....................................................................... 196 ~3 [$ z: ]8 |; H
7.4.2 镀铜(Copper Plating) ................................................................................................... 198 Y- n; i: Z- g3 P8 V% b
7.5 蚀刻(Etching) .......................................................................................................................... 20$ o$ Z' O& k" \$ |8 Z* z5 U
7.6 粘接(Bonding)........................................................................................................................ 204 o% B9 z) w# Q3 D: ^( _ b, k
7.7 多种材料多层(Multiple Material Multilayers)....................................................................... 21
5 m7 L" v7 A3 @- I7.8 测试(Testing).......................................................................................................................... 21+ {5 N4 Z$ s. y% j
8 器件固定和封装(DEVICE ATTACHMENTS AND PACKAGING)................................................ 210 ]5 o* C# b I9 j
8.1 将电路安装在腔体（Attaching the Circuit to the Housing） ............................................... 21
% X* `: u; H6 b8 |$ r! |, B8.1.1 机械固定（Mechanical Mounting）........................................................................... 21 p2 h. H% W! W. m6 }# T" Z6 f
8.1.1.1 聚四氟乙烯（PTFE Considerations） ............................................................. 21/ v# W; P2 C4 a6 @! A& t
8.1.2 环氧树脂（导电和绝缘的）[Epoxies (both conductive and nonconductive)]........... 21
: d) S! _1 Q7 j: p4 Z$ J8.1.3 热塑性膜（Thermoplastic Films） ............................................................................. 22% I- U s* V7 B) q" S
8.1.4 软钎焊（Soldering）................................................................................................... 22
4 L% t7 m1 I* u( b8.1.4.1 温度警示（Temperature Caution）.................................................................. 22
+ t7 s @: U) F/ ?8.1.5 直接粘结（Direct Bonding）...................................................................................... 22
3 c! W$ ]5 x1 u- Q8.2 连接器安装（Connector Attachment） ................................................................................. 22; S$ U O; s! f) `( G' s s8 c* q
8.2.1 边缘连接器（Edge Connector） ................................................................................ 225 _9 C, ^% C* ?
8.2.2 表面连接器（Surface Connector） ............................................................................ 233 {* ? M1 K9 x5 I
8.3 器件安装（Device Attachment）........................................................................................... 23
6 S9 P6 o/ Y9 v% ]: C8.3.1 焊接连接（Welded Bonds）....................................................................................... 23, w$ Y4 A' C9 \3 K
8.3.1.1 电阻焊接（Resistance Welding）.................................................................... 23% v& `6 p( @1 ? _; K
8.3.1.2 平行间隙焊接（Parallel Gap Welding） ......................................................... 23
, a5 E% }0 b% q8.3.1.3 电弧储能焊（Percussive Arc Welding） ......................................................... 24
- y1 f& L% |! d& e8.3.1.4 激光焊接（Laser Welding） ............................................................................ 24. N) |1 a' o% W* Q, I' b2 ]
8.3.1.5 软钎焊（Soldering）........................................................................................ 24* Z" w- e- X% P% t* A- w) h
8.3.2 扩散粘结（Diffusion Bonding） ................................................................................ 24
/ P# `6 h5 ~( D( E% z; E8.3.2.1 超声波焊接（Ultrasonic Welding） ................................................................ 24
8 R" Z3 e: S) _0 O3 [0 c4 QIII
. q4 T; z5 L- |) l0 f* e! NJuly 2002
) p4 v' w7 v- O6 j8.3.2.2 热压焊（Thermal Compression Bonding） ..................................................... 24
8 |# ]* [3 N& _3 ^8.3.2.3 超声热压焊接（Thermosonic Bonding）........................................................ 24
9 b8 z* W8 P" k/ m0 l8 o4 j X$ i8.3.3 器件安装（Device Attachment）................................................................................ 24 w$ [& ]" F" O5 m5 l+ m
8.3.3.1 超声波丝焊（Ultrasonic Wire Bonding）........................................................ 24
* W% J& _7 ]5 W: A' k" L6 F) B8.3.3.2 超声热（球）焊[Thermosonic (Ball) Bonding] ............................................... 254 U: U4 }( O6 _5 m) u
8.3.3.3 平行间隙焊接（Parallel Gap Welding）.......................................................... 25
# W* w/ G+ e2 g8 g. r8.3.3.4 热压键合（Thermal Compression Bonding） ................................................. 25
3 |8 i5 ~- E) ]- @. V0 ?8.3.3.5 再流焊（Solder Reflow）................................................................................. 257 j; O3 j! q$ y, j( O2 E1 R$ S
9 质量保证（QUALITY ASSURANCE） .......................................................................................... 25; Y, A; a: C3 F7 I
9.1 质量一致性鉴定（Quality Conformance Evaluations） ....................................................... 25
* B B- O+ m5 y& {- r9.2 可靠性（Reliability）............................................................................................................. 6 `9 c b# z, O; D- S
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发表于 2010-11-30 12:42
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