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IPC-2252射频/微波电路板设计指南
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IPC 2252射频微波电路板设计指南.pdf
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| 由IPC高速/高频委员会(D-20)的高速/高频设计任务组(D-21b)研究开发8 V9 l9 u; v- B$ |
目录7 O7 |* q9 S. T' Q9 Q/ j
1 概述(GENERAL)................................................................................................................................ 1 _- q" x5 o R& N, n5 f: B h
1.1 目的(Purpose)........................................................................................................................... 1
4 G, A; A- m; @1.2 范围(Scope).............................................................................................................................. 1
) f% ]! ?5 w" I1.3 术语和定义(Terms and Definitions)......................................................................................... 1" X% m( y1 G9 R4 g: f- e; u
2 应用文档(Application Documents) ..................................................................................................... 3# V7 l* I9 \. p+ P1 S
2.1 国际互联与封装协会(IPC) ...................................................................................................... 3
M1 v& s, Q* P+ t2.2 美国测试与材料协会(American Society for Testing and Materials) ....................................... 3
# O# c4 A1 \4 w* q+ m! \2.3 汽车工程师协会(Society of Automotive Engineers)................................................................ 3% c i V- ~: L
2.4 美国机械工程师协会(American Society of Mechanical Engineers) ....................................... 3! l/ _* e9 F& w! R
2.5 国际标准化组织(International Organization for Standardization)........................................... 3! S6 }4 U8 [8 w3 O; e
2.6 参考文档(Reference Information) ............................................................................................ 34 Q/ W3 O) C' g8 }+ B3 b r& q! {
3 设计考虑(DESIGN CONSIDERATIONS).......................................................................................... 3) L8 a! V' G5 J: t! n C, F6 d
3.1 最初输入(Initial Input).............................................................................................................. 3
2 K# M- l- [. Y, _# r2 `3.2 设计方案(Design Options)........................................................................................................ 31 o) e/ B5 `( T, C7 b9 x) f
3.3 传输线类型，材料和元件(Transmission Line Type, Materials, and Components) ................ 3' U( Q: b! v/ X! ~; K, A
3.4 电气设计(Electrical Design)..................................................................................................... 39 f% n5 p: H' ?# X/ ?$ h
3.5 机械设计(Mechanical Design).................................................................................................. 3
" Y6 P5 V# ? u, l4 m3.6 设计预审(Preliminary Design Review) .................................................................................... 3
" R7 t# g' | j4 v( z+ u3.7 电路实验板(Breadboard).......................................................................................................... 3% J, h3 @0 Y9 E* K) i
3.8 原型(Prototype)........................................................................................................................ 38 }! Y* W% l+ S7 W) i' u
3.9 文件编制(Documentation)........................................................................................................ 3
. Z; M2 D6 {6 t" \3.10 最终设计评审(Final Design Review)..................................................................................... 3
1 B& f, z# g1 j1 S: S* L$ d& [4 文档要求(DOCUMENTATION REQUIREMENTS) ......................................................................... 5
; B0 V% X- _7 p( P+ r: J1 U* _4.1 产品特性列表(Design Features Listing) .................................................................................. 5% @' N% y8 A5 P- J% H4 z
4.2 原图(Master Drawing) .............................................................................................................. 5: Q. b; K7 p/ A$ b0 W
4.3 原始图形(Master Pattern) ......................................................................................................... 5
5 V! N% D7 j/ v% ]8 I5 材料(MATERIALS)............................................................................................................................ 5* f( M w5 h3 B/ g! Y7 o' Z: y
5.1 微波印制电路板材料(Microwave Printed Circuit Board Materials) ....................................... 5
S/ c w" x) m3 y2 V5.1.1 基材选择(Substrate Selection)....................................................................................... 59 [$ f7 u3 `6 F! [; K/ e
5.1.1.1 相对介电常数(Relative Permittivity) ................................................................. 5
3 J, Y. ^ x4 o5 w$ H4 A5.1.1.2 损耗正切(Loss Tangent) ..................................................................................... 6
! A1 m" I: ]& h. h: I, ~4 S& H5.1.1.3 厚度(Thickness) .................................................................................................. 6$ J* U7 r: Z/ r
5.1.1.4 环境(Environment).............................................................................................. 7
- S& i; I7 ?$ k4 N+ e! ?' g1 [5.1.1.5 成本(Cost) ........................................................................................................... 75 @0 v* M! Q0 I: q/ f' |
5.1.1.6 供应商(Supplier) ................................................................................................. 7 z- \2 C( v; x- |5 ^
5.2 粘接膜(Bonding Films)............................................................................................................. 7+ J* w) e- {) _, }
5.2.1 热塑性粘接膜(Thermoplastic Bonding Films).............................................................. 7
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* Q# n. y( t' ?5 V9 b5.2.2 热固性粘接膜(Thermoset Bonding Films) .................................................................... 7
4 s! Y; @3 q' C! x& O4 H# ]7 F5.2.3 聚四氟乙烯粘接(PTFE Bonding Considerations) ......................................................... 86 M' j& A% Q) C9 @% t
5.3 金属(Metals)............................................................................................................................. 82 S$ y/ i2 x6 z' G" t# E
5.3.1 金属覆层(Cladding) ....................................................................................................... 8
; \& D0 I8 \7 s2 N. q5 {5.3.1.1 薄金属覆层(Thin Cladding Considerations)....................................................... 8# o! V1 I+ N) {) z- L
5.3.1.2 重磅金属覆层(Heavy Cladding Considerations) ................................................ 81 O2 _8 T: [" m3 B- f8 ?' z
5.3.2 金属镀层(Metal Plating) ................................................................................................ 8( |( Z. }8 {0 l4 V8 J! C
5.3.2.1 准备金属化的孔和边缘(Preparing Holes and Edges for Plating)...................... 9, M' N9 [; C- x0 K1 c
5.3.2.2 电镀铜(Electrodeposited Copper) ....................................................................... 9# n" @/ X1 J3 ~
5.3.2.3 镀镍(Nickel) ........................................................................................................ 9' }8 o. z( A' a( X' n( t
5.3.2.4 镀金(Gold)........................................................................................................... 9
2 p$ ~* J: }1 H! H! v' S5.3.2.5 镀银(Silver) ......................................................................................................... 9& Q- f f: S! h* G/ |0 {
5.3.2.6 镀锡-铅(Tin-lead) ................................................................................................ 9
2 T, v8 l |0 {' ^. S2 d4 G4 z6 M5.3.2.7 焊料镀层Solder Coating...................................................................................... 93 t' N7 p4 w) A" N5 p- y
5.3.2.8 浸锡(Immersion Tin) ........................................................................................... 9
8 v3 C/ [7 g4 F, k3 Q5.3.2.9 电镀锡(Electroplated Tin) ................................................................................... 9
: f" I6 Z" I& H# G5.3.3 电化腐蚀(Galvanic Corrosion)....................................................................................... 9
% m6 F! f, i" w8 _5 r5.3.4 铬转换镀层(Chromate Conversion Coating) ............................................................... 10
! g9 y; A" p9 x% e; E; Q5.4 仿型涂层(Conformal Coating)................................................................................................ 10# o2 `+ a0 c: t; m* V% y
5.4.1 一般注意事项(General Caution).................................................................................. 10, p6 l1 }3 i0 u' _
5.4.2 聚四氟乙烯(PTFE Considerations).............................................................................. 10! V% ?/ n* ^8 ]9 k
6 电气特性(ELECTRICAL CHARACTERISTICS) ............................................................................ 10) l* ~2 ?- T* r( `/ d2 {$ p, i
6.1 带状线(Stripline) ..................................................................................................................... 11: o# X% |0 q& v- [& b: m
6.1.1 带状线的特性阻抗(Characteristic Impedance of Stripline)......................................... 112 E0 T+ o" S" L4 C/ q
6.1.1.1 窄信号线(Narrow Signal Lines)........................................................................ 117 P0 q' e6 `: C7 d, m; k* ~
6.1.1.2 宽信号线(Wide Signal Lines) ........................................................................... 12: E+ e( ?3 o7 h% e% ?) @+ {: I- g
6.1.2 带状线的衰减(Attenuation in Stripline) ...................................................................... 12
5 a- n$ E7 v! D* W4 V% Q$ e6.1.2.1 窄信号线(Narrow signal lines).......................................................................... 12
% d# f$ @( n* @0 A& l3 e& ~6.1.2.2 宽信号线(Wide signal lines) ............................................................................. 12
4 Z4 u0 K. F3 h4 U3 ? {6.2 非对称带状线(Asymmetric Stripline)..................................................................................... 13
* o% Y0 C2 i+ p' M8 o6.3 微带线(Microstrip) .................................................................................................................. 13. X4 y; H+ q* G+ S
6.3.1 微带线的特性阻抗和有效相对介电常数(Characteristic Impedance and Effective
6 ~/ X. i! X6 _7 |. |- X$ oPermittivity f Microstrip)................................................................................................................ 13
* E. L2 b% j9 H" T6.3.2 微带线的衰减(Attenuation in Microstrip) ................................................................... 15
2 R. w: E1 W& O; z: W" ^2 D7 板的详细要求(TAILED BOARD REQUIREMENTS) ..................................................................... 15
7 P4 U% G8 U; j& T7.1 机械特性(Machined Features) ................................................................................................ 155 t+ ^& x1 t1 e& {9 f t% `& Q3 |
7.1.1 尺寸和公差(Dimensioning and Tolerancing)............................................................... 15
) J# x1 X% ]: Y A. C7.1.2 金属化过孔(Plated-Through Holes)............................................................................. 16
# ?! w- i. t0 u7.1.2.1 销针/接地(Pinning/Ground Connections) ......................................................... 17- n! u7 Z, q1 q3 C/ b6 Q# x
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2 i% k1 e" `; E( Y$ R: d$ L7.1.3 非金属化孔(Unplated Holes)....................................................................................... 172 ^) v* L0 s) Q F+ I" @$ |
7.1.4 深度腔和槽(Depth Pockets and Slots)......................................................................... 18' A% H4 D4 l M' [9 \6 B- d: x' {
7.1.5 内层接口加工(Inner-Layer Access Machining) .......................................................... 18
. `# p; g( n9 b2 f( X# k% A7.1.6 外形(Periphery)............................................................................................................ 18" x- X, H2 S+ m7 V; ]7 {% m
7.1.7 数控(NC)设备[Numerically Controlled (NC) Equipment].......................................... 18( V' D$ v! q+ O7 \- b
7.1.8 尺寸检查(Dimensional Inspection).............................................................................. 18
: h |: E8 N8 E7.2 出图(Imaging) ......................................................................................................................... 18
5 x, }4 T2 \* T8 V7.2.1 底片(Artwork).............................................................................................................. 19
5 h% I8 w5 i" g3 k6 H8 k+ t% J7.2.2 光致抗蚀剂(Photoresist).............................................................................................. 19
* E4 Y) e3 i% r8 D& {* z1 o7.2.3 环孔(Annular Rings) .................................................................................................... 19
+ ^" d' v! i' A. Z7 z/ i7.3 PTFE活化(PTFE Activation) ................................................................................................... 19' s( b; ]% F- W1 L
7.4 金属化(Metallization) ............................................................................................................. 19" Z9 q2 E! R3 H0 r+ \& H; R0 [9 j
7.4.1 边缘金属化设计(Plated Edge Designs)....................................................................... 19
w9 \# k0 U) {/ T7 j* P7.4.2 镀铜(Copper Plating) ................................................................................................... 19
2 b0 ~0 E! g0 `/ }8 R" a6 n7.5 蚀刻(Etching) .......................................................................................................................... 20 o% k& _/ ~ e3 h. z6 X4 r+ G; `# d
7.6 粘接(Bonding)........................................................................................................................ 20# P) ~9 z: E$ u/ ~' d- B p7 A
7.7 多种材料多层(Multiple Material Multilayers)....................................................................... 21
7 z& E: X$ W* R7.8 测试(Testing).......................................................................................................................... 21
& l" x+ m$ R+ I& l( \$ _8 器件固定和封装(DEVICE ATTACHMENTS AND PACKAGING)................................................ 21
9 E: T* |) S3 x) @/ |8.1 将电路安装在腔体（Attaching the Circuit to the Housing） ............................................... 21
0 l. p+ Y R( l6 |* l& s8.1.1 机械固定（Mechanical Mounting）........................................................................... 21) _4 p0 [( c/ e) p5 W
8.1.1.1 聚四氟乙烯（PTFE Considerations） ............................................................. 21, d" A3 h( {4 E! ]! o( r9 I
8.1.2 环氧树脂（导电和绝缘的）[Epoxies (both conductive and nonconductive)]........... 21% Y4 _. U% e5 Y& Z& c8 d& z
8.1.3 热塑性膜（Thermoplastic Films） ............................................................................. 22( M7 Y% Y7 w% W8 v0 i' \
8.1.4 软钎焊（Soldering）................................................................................................... 22, b$ R7 \8 l j
8.1.4.1 温度警示（Temperature Caution）.................................................................. 22
! a, s4 C; \; p/ A: b6 I2 h5 M& W8.1.5 直接粘结（Direct Bonding）...................................................................................... 22* G1 t) |3 |/ A9 K9 d( ], ]
8.2 连接器安装（Connector Attachment） ................................................................................. 22
/ ~( r- Z G- X2 P- k& o& ]8.2.1 边缘连接器（Edge Connector） ................................................................................ 22
7 W. _& c- O K9 T9 Q8.2.2 表面连接器（Surface Connector） ............................................................................ 23- M* o1 u: _/ Y4 x3 a0 o7 y0 R
8.3 器件安装（Device Attachment）........................................................................................... 23
1 x/ j0 d& s7 b( k: [$ A8.3.1 焊接连接（Welded Bonds）....................................................................................... 23
, F0 |" S. }( n6 s0 [" G' U0 X2 @8.3.1.1 电阻焊接（Resistance Welding）.................................................................... 238 P: ~' z! ?: u8 q
8.3.1.2 平行间隙焊接（Parallel Gap Welding） ......................................................... 23 h, i5 H* F- g4 W) j
8.3.1.3 电弧储能焊（Percussive Arc Welding） ......................................................... 24
/ y" T8 Q2 H1 C$ y+ r; U* H8.3.1.4 激光焊接（Laser Welding） ............................................................................ 24
+ o/ Q Y6 g2 y$ c8.3.1.5 软钎焊（Soldering）........................................................................................ 244 U; V4 O; r( r" m' w3 x/ x) E
8.3.2 扩散粘结（Diffusion Bonding） ................................................................................ 24+ T* P, W- @: L) ~
8.3.2.1 超声波焊接（Ultrasonic Welding） ................................................................ 24
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8 z2 |. G9 B. k' g+ G- J8.3.2.2 热压焊（Thermal Compression Bonding） ..................................................... 24
9 L! W }: M* l1 W& G4 u7 P8.3.2.3 超声热压焊接（Thermosonic Bonding）........................................................ 24 c2 f/ n; o& B K; L2 N3 i' x
8.3.3 器件安装（Device Attachment）................................................................................ 24; u9 I8 I+ s$ d* M; b
8.3.3.1 超声波丝焊（Ultrasonic Wire Bonding）........................................................ 24
- G6 L8 l4 k# \. q7 i" p8.3.3.2 超声热（球）焊[Thermosonic (Ball) Bonding] ............................................... 253 D2 X9 v, l% Z6 m# h. q R
8.3.3.3 平行间隙焊接（Parallel Gap Welding）.......................................................... 25
3 Z+ Y# C. w1 k" j8.3.3.4 热压键合（Thermal Compression Bonding） ................................................. 25
( n+ `& @/ u1 G' e8.3.3.5 再流焊（Solder Reflow）................................................................................. 25 W1 k9 p- X6 l8 K5 b" R3 c6 b
9 质量保证（QUALITY ASSURANCE） .......................................................................................... 257 E+ U6 _; P/ ^
9.1 质量一致性鉴定（Quality Conformance Evaluations） ....................................................... 25( @6 l. d! e) n* g7 n
9.2 可靠性（Reliability）.............................................................................................................
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发表于 2010-11-30 12:42
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