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1 逻辑电平的基本组成单元-三极管、MOS 管及其开关特性........................................... 53 k ~- ]( R2 ~1 o5 O
1.1 半导体三极管及其开关特性..................................................................................... 5
+ G* Q: p3 [% J) a, h- l; R1.2 MOS 管的开关特性......................................................................................................7* F: V; j$ N3 l: N' f! F
2、逻辑电平简介.................................................................................................................... 88 z7 y8 i) s8 }( q- K( O3 r! j
3、TTL 器件和CMOS 器件的逻辑电平............................................................................ 10
, K7 H: ^/ j+ G1 y# W4 R3.1:逻辑电平的一些概念............................................................................................... 10 [& H2 e& K/ o7 L V$ ~- p! Z: I3 A
3.2:常用的逻辑电平....................................................................................................... 113 ^4 U1 i2 y$ C
3.3:TTL 和CMOS 的逻辑电平关系.................................................................................. 11; t8 Y4 V5 ~/ }2 w0 E
4、TTL 和CMOS 逻辑器件.................................................................................................... 13
6 n$ _6 T: L; S4.1:TTL 和CMOS 器件的功能分类.................................................................................. 13
3 c d2 B' }! J, h# Q4.2:TTL 和MOS 逻辑器件的工艺分类特点....................................................................13
9 d* z# Y# q" u A4.3:TTL 和CMOS 逻辑器件的电平分类特点..................................................................13
7 f/ u3 h4 L2 t3 u4.4:包含特殊功能的逻辑器件....................................................................................... 14
" X( x+ \+ S3 k/ @2 Q4.5:逻辑器件的使用指南............................................................................................... 15
( L3 R1 l, b7 m: F( Z$ @+ Y* Z) F5、TTL、CMOS 器件的互连.................................................................................................. 16
' |4 V% J; |# f5 ?5.1:器件的互连总则.......................................................................................................16$ r9 u4 `; B8 I# o0 O0 j
5.2:5V TTL 门作驱动源..................................................................................................19
9 r9 x2 D$ `: }% D: z; p5.3:3.3V TTL/CMOS 门作驱动源..................................................................................... 19; f, G W2 |2 g) V1 H; k8 r
5.4:5V CMOS 门作驱动源................................................................................................ 19
! k% F, i0 T2 b5 s& v0 v5.5:2.5V CMOS 逻辑电平的互连.................................................................................... 19
. C0 ~! `! {# S6 X6、ECL 器件的原理和特点................................................................................................... 20 x. h: J/ H, O1 W+ B4 Y
6.1:ECL 器件的原理........................................................................................................20
$ z j: b* s, g. i6.2:ECL 电路的特性........................................................................................................21+ S. m9 G Z3 A F
6.3:ECL 器件的使用原则................................................................................................ 22. _6 r/ o9 I" l4 Y7 ]0 J
7、GTL 器件的原理和特点................................................................................................... 23
3 @( G) H! A. r7 c, J% r) N3 D7.1:GTL 器件的特点和电平............................................................................................ 23
8 y' V+ ]/ n( F6 m2 E7.2:GTL 信号的PCB 设计................................................................................................ 24
$ F. W9 M& |& t9 J- B. [" T7.3:GTL 信号的测试........................................................................................................25
% y0 ^( B9 _! J7.4:GTL 信号的时序........................................................................................................259 \ g) `6 H8 O0 {; V O+ \! [
8 HSTL 电平......................................................................................................................... 25; V1 x3 A8 v$ n5 K9 I7 M
8.1 基本定义..................................................................................................................... 25# B# l$ O/ M) W+ C
1.2 HSTL 分类.................................................................................................................... 26
+ J J3 L/ x# U- i. ~5 K' \8 N8.3 HSTL 特点及SSTL .....................................................................................................26, Y' b0 D, |/ M9 m0 D A+ ?
9 PECL、LVPECL 电平........................................................................................................... 27
7 Z# c6 L8 y( F L+ {; z9.1:PECL/LVPECL 器件的原理和特点............................................................................27+ A+ d3 J& v+ [7 I- X b# Z7 U
9.2. PECL/LVPECL 电平输出结构................................................................................... 27
2 [1 O1 L R+ X9.3 PECL/LVPECL 信号的输入输出门特点: ..................................................................292 Z7 f9 `) u+ }4 e& O" X U, G$ J
10 CML 电平......................................................................................................................... 30
: r3 l* J/ [+ T8 R) {6 P2 H' v10.1. CML 接口输出结构............................................................................................... 30
- D3 ~: {6 ^7 l/ m |10.2 CML 接口输入结构...................................................................................................30
! F& w5 b. o% L7 E6 D8 p% L. w/ M10.3 CML 电平的输出门和输入门的特点: ....................................................................31
) C1 h7 b5 X) I8 F, Z$ t11. LVDS 器件的原理和特点.......................................................................................... 32( V1 K3 s' U6 J, v; H3 C
11.1:LVDS 器件简介........................................................................................................32) ]8 Y ^5 `- I1 D$ [# B
11.2 LVDS 器件的工作原理.............................................................................................. 330 i/ B% k6 d+ d& \9 i
11.3 LVDS 输入输出结构.................................................................................................33
5 H: N: G9 i. Q, u! L) K3 r11.4 LVDS 电平的特点...................................................................................................35
$ X2 M7 W3 r0 L+ Y12. CML LVPECL LVDS 简单比较及互连......................................................................... 35 Y. P. k3 B, P' H6 p+ Y
12.1 CML LVPECL LVDS 简单比较..............................................................................35
' g0 |+ s5 ^: K% g( f12.2 CML LVPECL LVDS 的互连综述..........................................................................38- _( [. Z1 E4 C& I
12.3 LVPECL 的互连........................................................................................................39
) b, J- z/ a n+ N12.4 LVDS 的互连............................................................................................................448 h; P* y9 s- z4 Z' M& Q
12.5 CML 的互连..............................................................................................................455 u6 e3 G6 l2 M: i6 H
附录:.................................................................................................................................... 479 Q. j5 D9 ^7 S+ S( P3 U: p
附录1. 集成TTL 与非门电路、OC 门电路及其特性..................................................... 47- @: t! G, D6 F; n
附录2. CMOS 门电路及其特点.................................................................................... 59
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