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1 逻辑电平的基本组成单元－三极管、MOS 管及其开关特性........................................... 59 P/ Y; ?1 d% l+ E
1．1 半导体三极管及其开关特性..................................................................................... 5
+ ?- i# b1 n' @) `5 m1．2 MOS 管的开关特性......................................................................................................7
J5 U7 \. P+ I+ {% X& Z2、逻辑电平简介.................................................................................................................... 8
7 M4 W' w' o! |- n! A" r% l! \3、TTL 器件和CMOS 器件的逻辑电平............................................................................ 10
5 o) P- d6 G% b" E! x4 S/ D0 f3.1：逻辑电平的一些概念............................................................................................... 10# G5 d4 T) h O J$ b7 J6 J
3.2：常用的逻辑电平....................................................................................................... 11
4 T( i* |+ q6 r% s2 T% m3.3：TTL 和CMOS 的逻辑电平关系.................................................................................. 11% [2 o( p3 b% C
4、TTL 和CMOS 逻辑器件.................................................................................................... 13
5 m- D: I; J0 V, F1 [; ^: f4.1：TTL 和CMOS 器件的功能分类.................................................................................. 13
0 I1 z" o) A$ s' e; d2 W1 d" t7 c. \3 ?. h4.2：TTL 和MOS 逻辑器件的工艺分类特点....................................................................13 I& |& A/ R6 n; ]
4.3：TTL 和CMOS 逻辑器件的电平分类特点..................................................................13
/ H" I/ \6 M) D, K% v W4.4：包含特殊功能的逻辑器件....................................................................................... 145 G) I+ p; P% M! {$ P
4.5：逻辑器件的使用指南............................................................................................... 15
3 w" i3 O$ }4 J4 J' x2 t8 L* ?3 x5、TTL、CMOS 器件的互连.................................................................................................. 16
+ U/ J) Z/ [% K, d2 O, @! O5.1：器件的互连总则.......................................................................................................16# {- G+ [9 y1 w( D v
5.2：5V TTL 门作驱动源..................................................................................................19
* k# n o" l, T# z% y5.3：3.3V TTL/CMOS 门作驱动源..................................................................................... 19( A1 x% ^/ [% J* h6 s# z9 B
5.4：5V CMOS 门作驱动源................................................................................................ 19
$ X m7 j: P3 W: k5.5：2.5V CMOS 逻辑电平的互连.................................................................................... 191 Z4 x6 ]8 E2 s" G7 F
6、ECL 器件的原理和特点................................................................................................... 20
- A) P+ z3 L# K9 a3 Z% d! @6.1：ECL 器件的原理........................................................................................................20+ ?3 G3 A# K; q
6.2：ECL 电路的特性........................................................................................................21
! A8 j& p8 d1 @$ E0 b0 d2 ^$ k6.3：ECL 器件的使用原则................................................................................................ 22
; N5 x w3 f' t- F( ~- e7、GTL 器件的原理和特点................................................................................................... 23: Y1 i& s9 T# a, x; u7 B+ L
7.1：GTL 器件的特点和电平............................................................................................ 23
x4 _ Q; m% v6 |( D" s* h/ J' R7.2：GTL 信号的PCB 设计................................................................................................ 24% P) b3 a2 M4 M* E
7.3：GTL 信号的测试........................................................................................................258 _, R! J8 ]% Y0 n" `/ \
7.4：GTL 信号的时序........................................................................................................25
% ]+ ]7 y# ^% L5 l8 X! H8 HSTL 电平......................................................................................................................... 25, m" U3 j7 F8 o+ d1 Q1 S6 U; b% V1 U
8.1 基本定义..................................................................................................................... 25
* U6 M' x5 A7 q& ~1.2 HSTL 分类.................................................................................................................... 261 ^6 R7 J! L" Q( w# i- L# B( O8 N
8.3 HSTL 特点及SSTL .....................................................................................................268 z; R. [' ?0 ]* P8 ]; l' q! U
9 PECL、LVPECL 电平........................................................................................................... 27' G- Q$ l- ^% k+ g; u' r
9.1：PECL/LVPECL 器件的原理和特点............................................................................27$ r- o l, M4 d0 Y r# g
9.2. PECL/LVPECL 电平输出结构................................................................................... 276 M1 @4 L! m1 \0 F# |' s
9.3 PECL/LVPECL 信号的输入输出门特点： ..................................................................29
7 U5 f) F f: L0 p; J* S0 h10 CML 电平......................................................................................................................... 303 _# }( e' @4 V; x1 z
10.1. CML 接口输出结构............................................................................................... 30( a) z+ M9 ^7 j2 T3 Q
10.2 CML 接口输入结构...................................................................................................30 c( ?* s( L, b% F! l+ n' z
10.3 CML 电平的输出门和输入门的特点： ....................................................................312 g3 p/ C& N2 j9 o4 ~$ J$ w
11. LVDS 器件的原理和特点.......................................................................................... 32
4 |3 W2 n* K/ ~% B- j& v" P11.1：LVDS 器件简介........................................................................................................32
9 F; C5 @, e& k0 q# S: r7 D11.2 LVDS 器件的工作原理.............................................................................................. 33
" d+ k: i9 @, q" X6 L) S% q11.3 LVDS 输入输出结构.................................................................................................33# ^# A1 i% e. H4 m, F
11.4 LVDS 电平的特点...................................................................................................35
( b1 Z$ G: j+ e7 p7 K) n12. CML LVPECL LVDS 简单比较及互连......................................................................... 35
; g1 K' {/ w& a1 t. _/ _6 D8 f12.1 CML LVPECL LVDS 简单比较..............................................................................35( _+ A3 x( m2 f* ^
12.2 CML LVPECL LVDS 的互连综述..........................................................................38; \. z0 j# y$ b
12.3 LVPECL 的互连........................................................................................................39
0 k) v" Q6 `3 g. ^. ~12.4 LVDS 的互连............................................................................................................443 q- V" W+ u2 `
12.5 CML 的互连..............................................................................................................450 K! K' ?/ j/ V- _' v) h$ V
附录：.................................................................................................................................... 47
. B+ f$ n. W b9 }附录1. 集成TTL 与非门电路、OC 门电路及其特性..................................................... 47
1 _; v& c% g! ?1 v' c附录2． CMOS 门电路及其特点.................................................................................... 59
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发表于 2017-11-13 16:15
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