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另外我查了一下板厂的板材结构:
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1 oz copper (1.4 mil)
. R& ]" O! a, D 6.7 mil prepreg0 b, |5 m- s2 p& l
0.5 oz copper (0.7 mil)
) U; c( f7 l* h7 p( E' {: m7 [ 47 mil core8 L% T* ?9 w0 a# y; G
0.5 oz copper (0.7 mil)$ w" f6 i. @9 t6 _$ u; }
6.7 mil prepreg
: d& F+ L, Z! D- r L8 s1 d 1 oz copper (1.4 mil)
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The substrate for both the core and prepreg is FR408, with a dielectric constant of 3.66 at 1GHz。
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这个没提到阻焊层的信息,我用si9000计算的差分100欧阻抗匹配的时候,是要(1)Edge-Counpled Surface Microstrip 1B ---不带阻焊层;还是(2)Edge-Coupled Coated Microstrip 1B --- 带阻焊层?7 c. J+ F$ ^% T: Q8 \% d7 b
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