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1 逻辑电平的基本组成单元－三极管、MOS 管及其开关特性........................................... 5
. k& Q7 Z6 L5 |# r1．1 半导体三极管及其开关特性..................................................................................... 5! E% s* I& |, X) J
1．2 MOS 管的开关特性......................................................................................................7! E/ a; e' K, p2 G9 P7 v s
2、逻辑电平简介.................................................................................................................... 8, } A& X- D* G* z2 @4 D
3、TTL 器件和CMOS 器件的逻辑电平............................................................................ 10
, j# a: X b7 ~% V1 A3.1：逻辑电平的一些概念............................................................................................... 10: ~+ }7 W' h; D" A! V: x: @
3.2：常用的逻辑电平....................................................................................................... 11
l2 q( v( Y8 R# M8 Z+ c3.3：TTL 和CMOS 的逻辑电平关系.................................................................................. 11
( Q2 b/ G2 P+ H, ^! K3 e8 P4、TTL 和CMOS 逻辑器件.................................................................................................... 131 S- O+ C5 M6 @3 q1 u0 o+ p) k6 y0 Y
4.1：TTL 和CMOS 器件的功能分类.................................................................................. 13
2 z. d3 \% t1 t" _4.2：TTL 和MOS 逻辑器件的工艺分类特点....................................................................13
/ q% {7 B( P: o5 ?4.3：TTL 和CMOS 逻辑器件的电平分类特点..................................................................13& y& u# x# t' P8 h5 m6 L
4.4：包含特殊功能的逻辑器件....................................................................................... 14
3 `7 }6 I: [3 |7 g4.5：逻辑器件的使用指南............................................................................................... 157 c/ l% ~3 M V( `4 c
5、TTL、CMOS 器件的互连.................................................................................................. 16+ X: b2 f; T% i. ~" U! b' D2 {5 C
5.1：器件的互连总则.......................................................................................................16* f8 a0 w, a3 b& t' s* [
5.2：5V TTL 门作驱动源..................................................................................................19
4 z* o1 T; Z$ `4 b6 L: x+ D5.3：3.3V TTL/CMOS 门作驱动源..................................................................................... 19
- P1 \+ [" r( x3 ~5.4：5V CMOS 门作驱动源................................................................................................ 19
, {% H3 Z" ?) F; k5.5：2.5V CMOS 逻辑电平的互连.................................................................................... 19
u5 ]5 L* i* _- a6、ECL 器件的原理和特点................................................................................................... 20
2 l/ E- F U# k. U! Q5 p6.1：ECL 器件的原理........................................................................................................20
7 F( F' {- f0 d9 g6 I" N6.2：ECL 电路的特性........................................................................................................21 I: v/ E: |. {# w4 g4 l/ g: n
6.3：ECL 器件的使用原则................................................................................................ 22( U" j9 b, a6 P" K
7、GTL 器件的原理和特点................................................................................................... 23
9 u& W& t7 v) m+ b2 W. I7.1：GTL 器件的特点和电平............................................................................................ 23; F5 ]7 I+ \/ ~) s$ c( V5 W; W
7.2：GTL 信号的PCB 设计................................................................................................ 24
# o4 }" R, V( V" A* v, ]9 c7.3：GTL 信号的测试........................................................................................................256 A7 F2 n4 C' m4 [! r9 [# Q! r# J
7.4：GTL 信号的时序........................................................................................................25) ^; O' l7 D3 C" {8 y9 f9 Q
8 HSTL 电平......................................................................................................................... 25
' m. N4 g( L, ?3 W8.1 基本定义..................................................................................................................... 25
/ x6 O- x! S! [1.2 HSTL 分类.................................................................................................................... 26: P1 e; b; E$ S) l) W
8.3 HSTL 特点及SSTL .....................................................................................................26, B* h* {' F* `% J* A
9 PECL、LVPECL 电平........................................................................................................... 27$ U2 i7 Q+ u4 E2 n0 }" U4 Z
9.1：PECL/LVPECL 器件的原理和特点............................................................................27
- F' ?/ U# V% C9 L. p" B9.2. PECL/LVPECL 电平输出结构................................................................................... 272 I P r" }- k, R. n: G. h0 c
9.3 PECL/LVPECL 信号的输入输出门特点： ..................................................................29/ p& i* E7 |; }8 }2 N
10 CML 电平......................................................................................................................... 30! I& e4 G1 a' z) _2 a$ |- V
10.1. CML 接口输出结构............................................................................................... 30
& _2 n$ T K% V2 k1 K8 |' d3 V) X9 k7 M10.2 CML 接口输入结构...................................................................................................30
% o, J+ @: x% v* i3 q6 R10.3 CML 电平的输出门和输入门的特点： ....................................................................31
/ \: V( p) @" m0 s% C) t+ p4 S11. LVDS 器件的原理和特点.......................................................................................... 32
I. z9 q0 r* `4 p' ]11.1：LVDS 器件简介........................................................................................................32; ]) k; A: E; ?" r% h
11.2 LVDS 器件的工作原理.............................................................................................. 33- F% |4 E( {2 Q0 X8 c
11.3 LVDS 输入输出结构.................................................................................................33$ Q+ z! X# C0 W. |) W( b2 H
11.4 LVDS 电平的特点...................................................................................................35
! u4 W& u/ ?) |- q2 R12. CML LVPECL LVDS 简单比较及互连......................................................................... 35
. F+ r! X! j: e- ~8 {12.1 CML LVPECL LVDS 简单比较..............................................................................35
* ~% G. h- l. h( ?0 M2 R* e12.2 CML LVPECL LVDS 的互连综述..........................................................................38
. O/ t& f; p' c8 P! w! Q& [12.3 LVPECL 的互连........................................................................................................39
8 w0 S. b0 M7 I+ z$ t/ P12.4 LVDS 的互连............................................................................................................44# f& S& ~' e' x( q3 A
12.5 CML 的互连..............................................................................................................45
; X; E% C" o G& C! T附录：.................................................................................................................................... 47
0 D9 E7 Q" j& I8 v0 b+ p! t附录1. 集成TTL 与非门电路、OC 门电路及其特性..................................................... 478 ?: L+ t( X! a, v. A% p
附录2． CMOS 门电路及其特点.................................................................................... 598 p! d$ }6 n' u" U
9 t" t2 d+ o( r& C# P
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发表于 2017-11-13 16:15
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