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另外我查了一下板厂的板材结构:
; r9 q' a, h. ?; k C/ ]; y9 W4 Layer Board Stackup and Specifications :
) O. W- V1 s0 G: n0 r% c 1 oz copper (1.4 mil)
, C/ B0 M) s) j* b% C 6.7 mil prepreg
2 J2 l/ m" Z; U5 Q: H 0.5 oz copper (0.7 mil)
$ y, Q- n9 y) S( {. Q: G 47 mil core
, i* [# ^" o0 E0 c9 N- q 0.5 oz copper (0.7 mil)2 m6 o+ V) ?( @: `* k4 Y ^
6.7 mil prepreg
* N* G6 s( w' }1 s* [, P 1 oz copper (1.4 mil)
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The substrate for both the core and prepreg is FR408, with a dielectric constant of 3.66 at 1GHz。
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这个没提到阻焊层的信息,我用si9000计算的差分100欧阻抗匹配的时候,是要(1)Edge-Counpled Surface Microstrip 1B ---不带阻焊层;还是(2)Edge-Coupled Coated Microstrip 1B --- 带阻焊层?
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