PDS

Iric071 · 发表于 2007-12-28 17:23

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PCB Stackup and Layer Order中:
Power supplies with high transient current should have their associated VCC planes close to the
top surface (FPGA side) of the PCB stackup to decrease the distance in the vertical direction
that currents travel through VCC and GND vias before reaching the associated VCC and GND
planes. As mentioned in the previous section, every VCC plane should have a GND plane
adjacent to it in the stackup to reduce spreading inductance. Since high-frequency currents
couple tightly due to skin effect, the GND plane adjacent to a given VCC plane tends to carry the
majority of the current complementary to that in the VCC plane. For this reason, adjacent VCC
and GND planes are considered as a pair.
這裡面,說的VCC,GND層到底所何放置?
謝謝!

只看该作者 · 发表于 2007-12-29 09:55

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liujie123 · 发表于 2007-12-29 11:28

学习了

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