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一年一度的全球高速设计盛会Designcon 2018圆满落幕,Cadence与思科、富士康、英特尔等客户的演讲资料已开放,干货满满,快来下载哦!: C; z9 W- h; c9 }, v& a4 O; [
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4 [+ V! D# W) i: v7 hKen Willis, Product Engineering Architect,Cadence发表演讲
/ L* W/ ]9 n4 ~; L2 O3 v- h演讲资料大纲: Reduction of Mode Conversion in SerDes Links Performance Analysis for Next-Generation PCIeInterface Backchannel Modeling and Simulation Using RecentEnhancements to the IBIS Standard Temperature- and Geometry-Dependent Analysis ofHigh-Speed PCB Traces DDR-4400 IP Model Development Using AMI Builder Advanced IC Packaging Trends and Their Impact onEDA Tools HSSO - Physical Structure Optimization forHigh-Speed Interconnects Brand-New Electrical and Thermal Co-SimulationAnalysis A New Platform Power Integrity Design Approachwith SPIM and UPIT DDR5 Modeling Using Automated IBIS-AMI ModelingTechnology ; o$ ]0 G& E5 ]! n2 D$ `
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欢迎您的评论! 您可以通过PCB_marketing_China@cadence.com联系我们,非常感谢您的关注以及宝贵意见。
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