IPC 2252射频微波电路板设计指南.pdf
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1 概述(GENERAL)................................................................................................................................ 1; A* H! W: h) u* L* h U; j
1.1 目的(Purpose)........................................................................................................................... 1/ T: Z8 c: r" p) U1 Y2 c
1.2 范围(Scope).............................................................................................................................. 17 @1 o" \0 R7 O4 S' G+ \2 q
1.3 术语和定义(Terms and Definitions)......................................................................................... 1
2 应用文档(Application Documents) ..................................................................................................... 38 } X' x, o4 g# l+ Y! I
2.1 国际互联与封装协会(IPC) ...................................................................................................... 3
2.2 美国测试与材料协会(American Society for Testing and Materials) ....................................... 33 E, g2 w# X- Y, Q$ Y
2.3 汽车工程师协会(Society of Automotive Engineers)................................................................ 3- q; f% u6 `5 e0 r8 f0 K% w
2.4 美国机械工程师协会(American Society of Mechanical Engineers) ....................................... 3
2.5 国际标准化组织(International Organization for Standardization)........................................... 36 s; n) k; u+ e3 H$ i3 J5 q; ~) t
2.6 参考文档(Reference Information) ............................................................................................ 32 M1 Z, O6 ~9 g; d; e2 L: _6 w
3 设计考虑(DESIGN CONSIDERATIONS).......................................................................................... 3! h& l' Y/ s. `; L
3.1 最初输入(Initial Input).............................................................................................................. 3
3.2 设计方案(Design Options)........................................................................................................ 3
3.3 传输线类型，材料和元件(Transmission Line Type, Materials, and Components) ................ 3( y) R* B5 q( o8 R. d; N
3.4 电气设计(Electrical Design)..................................................................................................... 3
3.5 机械设计(Mechanical Design).................................................................................................. 32 h! F% X9 l: W) r. l- s
3.6 设计预审(Preliminary Design Review) .................................................................................... 3) |- V2 A3 p, O2 `. y( g) o
3.7 电路实验板(Breadboard).......................................................................................................... 3$ f# V9 D$ V& v" o: }) r# G
3.8 原型(Prototype)........................................................................................................................ 3
3.9 文件编制(Documentation)........................................................................................................ 3! g: M+ r2 [0 e. p) R4 N3 J
3.10 最终设计评审(Final Design Review)..................................................................................... 3
4 文档要求(DOCUMENTATION REQUIREMENTS) ......................................................................... 5
4.1 产品特性列表(Design Features Listing) .................................................................................. 5' c# Q8 U1 M' b' S
4.2 原图(Master Drawing) .............................................................................................................. 5' B" v) O2 ?9 S4 h4 [5 C/ O
4.3 原始图形(Master Pattern) ......................................................................................................... 5
5 材料(MATERIALS)............................................................................................................................ 5
5.1 微波印制电路板材料(Microwave Printed Circuit Board Materials) ....................................... 5
5.1.1 基材选择(Substrate Selection)....................................................................................... 5/ n, D/ n& F) [/ h- t3 K2 I
5.1.1.1 相对介电常数(Relative Permittivity) ................................................................. 5) ` _5 ^4 x `* {
5.1.1.2 损耗正切(Loss Tangent) ..................................................................................... 6& k% P; v1 V2 o; ^ a7 Q. n" h
5.1.1.3 厚度(Thickness) .................................................................................................. 6: h7 i1 j, Q& `0 z8 R* H
5.1.1.4 环境(Environment).............................................................................................. 7
5.1.1.5 成本(Cost) ........................................................................................................... 79 ~, |) ?* t- D; P) Z7 r
5.1.1.6 供应商(Supplier) ................................................................................................. 7
5.2 粘接膜(Bonding Films)............................................................................................................. 7
5.2.1 热塑性粘接膜(Thermoplastic Bonding Films).............................................................. 7% q! F7 k7 i8 Y7 A: _
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5.2.2 热固性粘接膜(Thermoset Bonding Films) .................................................................... 7
5.2.3 聚四氟乙烯粘接(PTFE Bonding Considerations) ......................................................... 8
5.3 金属(Metals)............................................................................................................................. 8
5.3.1 金属覆层(Cladding) ....................................................................................................... 8
5.3.1.1 薄金属覆层(Thin Cladding Considerations)....................................................... 8
5.3.1.2 重磅金属覆层(Heavy Cladding Considerations) ................................................ 8" x) |: ?8 l7 s+ U! p+ ? n
5.3.2 金属镀层(Metal Plating) ................................................................................................ 8
5.3.2.1 准备金属化的孔和边缘(Preparing Holes and Edges for Plating)...................... 9
5.3.2.2 电镀铜(Electrodeposited Copper) ....................................................................... 99 K; m' x7 ^4 X4 i, s m V
5.3.2.3 镀镍(Nickel) ........................................................................................................ 9: ?5 l+ T4 L3 J- Q: G' ?. f5 O1 H* p# U! |
5.3.2.4 镀金(Gold)........................................................................................................... 9
5.3.2.5 镀银(Silver) ......................................................................................................... 9
5.3.2.6 镀锡-铅(Tin-lead) ................................................................................................ 9( T$ q/ D6 ^) v4 a5 b+ b
5.3.2.7 焊料镀层Solder Coating...................................................................................... 9 N9 W& a! k& t7 t
5.3.2.8 浸锡(Immersion Tin) ........................................................................................... 9
5.3.2.9 电镀锡(Electroplated Tin) ................................................................................... 9
5.3.3 电化腐蚀(Galvanic Corrosion)....................................................................................... 9
5.3.4 铬转换镀层(Chromate Conversion Coating) ............................................................... 10* \- r U% M) X0 x3 y6 @% o
5.4 仿型涂层(Conformal Coating)................................................................................................ 10; q1 g2 v+ R, e0 i8 @7 j9 A
5.4.1 一般注意事项(General Caution).................................................................................. 10
5.4.2 聚四氟乙烯(PTFE Considerations).............................................................................. 10# m8 W9 ~% _' \2 M
6 电气特性(ELECTRICAL CHARACTERISTICS) ............................................................................ 106 r& P. b, z; D0 L9 g: w
6.1 带状线(Stripline) ..................................................................................................................... 115 l# V# ?" N. m) c: L& y, p
6.1.1 带状线的特性阻抗(Characteristic Impedance of Stripline)......................................... 114 ^6 O, [' L5 K$ B X) w/ i+ O% J
6.1.1.1 窄信号线(Narrow Signal Lines)........................................................................ 11% j1 ~6 S: h; Y- x; z2 w
6.1.1.2 宽信号线(Wide Signal Lines) ........................................................................... 12
6.1.2 带状线的衰减(Attenuation in Stripline) ...................................................................... 12
6.1.2.1 窄信号线(Narrow signal lines).......................................................................... 12
6.1.2.2 宽信号线(Wide signal lines) ............................................................................. 120 B: @8 g1 g6 X* n9 ^ E$ u# i7 X
6.2 非对称带状线(Asymmetric Stripline)..................................................................................... 13* d8 w- g3 F* K9 [6 ?
6.3 微带线(Microstrip) .................................................................................................................. 13
6.3.1 微带线的特性阻抗和有效相对介电常数(Characteristic Impedance and Effective
Permittivity f Microstrip)................................................................................................................ 13* J: v7 ^0 a. `6 W
6.3.2 微带线的衰减(Attenuation in Microstrip) ................................................................... 15) J2 T {1 A& }7 i
7 板的详细要求(TAILED BOARD REQUIREMENTS) ..................................................................... 15
7.1 机械特性(Machined Features) ................................................................................................ 15
7.1.1 尺寸和公差(Dimensioning and Tolerancing)............................................................... 152 ~- S# z8 K3 I2 f) x# u" E
7.1.2 金属化过孔(Plated-Through Holes)............................................................................. 16
7.1.2.1 销针/接地(Pinning/Ground Connections) ......................................................... 17
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7.1.3 非金属化孔(Unplated Holes)....................................................................................... 17
7.1.4 深度腔和槽(Depth Pockets and Slots)......................................................................... 18
7.1.5 内层接口加工(Inner-Layer Access Machining) .......................................................... 18: Q2 G% H9 D- [) G
7.1.6 外形(Periphery)............................................................................................................ 188 w$ v; J1 j e" p' h8 U7 {4 X$ W4 y
7.1.7 数控(NC)设备[Numerically Controlled (NC) Equipment].......................................... 18
7.1.8 尺寸检查(Dimensional Inspection).............................................................................. 18
7.2 出图(Imaging) ......................................................................................................................... 18
7.2.1 底片(Artwork).............................................................................................................. 19, O) n/ s5 O `4 d a+ c3 T' }
7.2.2 光致抗蚀剂(Photoresist).............................................................................................. 199 y: S* X. D+ ~# n6 R) ]
7.2.3 环孔(Annular Rings) .................................................................................................... 19- M: B* {9 U$ W0 Z/ j) F8 u
7.3 PTFE活化(PTFE Activation) ................................................................................................... 19
7.4 金属化(Metallization) ............................................................................................................. 19/ |( l+ j) I1 k8 L0 K' @0 w4 ~
7.4.1 边缘金属化设计(Plated Edge Designs)....................................................................... 194 e* r L+ \5 [: v5 L
7.4.2 镀铜(Copper Plating) ................................................................................................... 19
7.5 蚀刻(Etching) .......................................................................................................................... 20: Y. V. Y( G- z# f
7.6 粘接(Bonding)........................................................................................................................ 20( Y' F" U" A6 i: e2 N
7.7 多种材料多层(Multiple Material Multilayers)....................................................................... 21# L7 W O, g8 H y% \
7.8 测试(Testing).......................................................................................................................... 214 y( T% ]7 U/ |. C
8 器件固定和封装(DEVICE ATTACHMENTS AND PACKAGING)................................................ 21
8.1 将电路安装在腔体（Attaching the Circuit to the Housing） ............................................... 21
8.1.1 机械固定（Mechanical Mounting）........................................................................... 21' h! E) X% r D6 b3 C2 M, }
8.1.1.1 聚四氟乙烯（PTFE Considerations） ............................................................. 21
8.1.2 环氧树脂（导电和绝缘的）[Epoxies (both conductive and nonconductive)]........... 21
8.1.3 热塑性膜（Thermoplastic Films） ............................................................................. 22
8.1.4 软钎焊（Soldering）................................................................................................... 22
8.1.4.1 温度警示（Temperature Caution）.................................................................. 22
8.1.5 直接粘结（Direct Bonding）...................................................................................... 22% G/ m& p8 f& D- B3 k& W( Y& \3 w
8.2 连接器安装（Connector Attachment） ................................................................................. 22
8.2.1 边缘连接器（Edge Connector） ................................................................................ 22
8.2.2 表面连接器（Surface Connector） ............................................................................ 23" z& u0 X- H% H3 W
8.3 器件安装（Device Attachment）........................................................................................... 23
8.3.1 焊接连接（Welded Bonds）....................................................................................... 23
8.3.1.1 电阻焊接（Resistance Welding）.................................................................... 235 I, f& t/ u; C; W
8.3.1.2 平行间隙焊接（Parallel Gap Welding） ......................................................... 23, j: j2 N2 S9 c
8.3.1.3 电弧储能焊（Percussive Arc Welding） ......................................................... 24/ J" B7 g$ i3 f- P# [. c$ ^
8.3.1.4 激光焊接（Laser Welding） ............................................................................ 24, {! u. A9 d1 J5 B) L2 X! I! L3 }/ b
8.3.1.5 软钎焊（Soldering）........................................................................................ 24, `' I- C1 z1 b! }8 a. z2 U
8.3.2 扩散粘结（Diffusion Bonding） ................................................................................ 24% G1 K# ~, x3 Q' a# X I6 Z
8.3.2.1 超声波焊接（Ultrasonic Welding） ................................................................ 24
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8.3.2.2 热压焊（Thermal Compression Bonding） ..................................................... 24
8.3.2.3 超声热压焊接（Thermosonic Bonding）........................................................ 24
8.3.3 器件安装（Device Attachment）................................................................................ 24
8.3.3.1 超声波丝焊（Ultrasonic Wire Bonding）........................................................ 24
8.3.3.2 超声热（球）焊[Thermosonic (Ball) Bonding] ............................................... 25
8.3.3.3 平行间隙焊接（Parallel Gap Welding）.......................................................... 25
8.3.3.4 热压键合（Thermal Compression Bonding） ................................................. 25
8.3.3.5 再流焊（Solder Reflow）................................................................................. 259 u# V! ?' T' S, v9 L5 H9 j
9 质量保证（QUALITY ASSURANCE） .......................................................................................... 25! Q1 V. g$ \1 e( @+ b+ E
9.1 质量一致性鉴定（Quality Conformance Evaluations） ....................................................... 25
9.2 可靠性（Reliability）.............................................................................................................
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