EDA365电子工程师网

标题: 逻辑电平接口 [打印本页]

---

作者: liubingbuku    时间: 2017-11-13 16:15
标题: 逻辑电平接口
1 逻辑电平的基本组成单元－三极管、MOS 管及其开关特性........................................... 5
1．1 半导体三极管及其开关特性..................................................................................... 5
+ ?+ n" o6 B% C" ?3 Y. d1．2 MOS 管的开关特性......................................................................................................7
' H+ G+ [* d2 U* W/ O5 r2、逻辑电平简介.................................................................................................................... 8
0 V5 a) L) ]% h* `+ V3、TTL 器件和CMOS 器件的逻辑电平............................................................................ 10
3.1：逻辑电平的一些概念............................................................................................... 10
3.2：常用的逻辑电平....................................................................................................... 11
2 q4 ~: i* i8 M) e" y3.3：TTL 和CMOS 的逻辑电平关系.................................................................................. 11
5 \/ J+ ~; V) O2 M  G0 p4 E4、TTL 和CMOS 逻辑器件.................................................................................................... 13
% G, Q8 b. ~% O3 m! z/ w4.1：TTL 和CMOS 器件的功能分类.................................................................................. 13
/ @% D; Q/ g7 N# @3 s' f; V* x4.2：TTL 和MOS 逻辑器件的工艺分类特点....................................................................13
4.3：TTL 和CMOS 逻辑器件的电平分类特点..................................................................13
5 Y3 D9 C+ V; l+ `5 y& a$ s4.4：包含特殊功能的逻辑器件....................................................................................... 14
4.5：逻辑器件的使用指南............................................................................................... 15
5、TTL、CMOS 器件的互连.................................................................................................. 16
3 E2 Q" F2 H0 e' z6 W! Y2 ?5.1：器件的互连总则.......................................................................................................16
5.2：5V TTL 门作驱动源..................................................................................................19
2 X) S& p+ V: K5.3：3.3V TTL/CMOS 门作驱动源..................................................................................... 19
! H6 B" b& x- F2 M8 u8 Y3 K5.4：5V CMOS 门作驱动源................................................................................................ 19
/ c) _1 a0 _* F! W6 P# o5.5：2.5V CMOS 逻辑电平的互连.................................................................................... 19
7 W$ |: c* ?1 {- r# l9 l6、ECL 器件的原理和特点................................................................................................... 20
1 V! {" E# u2 c% Y- Y: \5 m$ K6.1：ECL 器件的原理........................................................................................................20
: b2 J( G8 s) S6.2：ECL 电路的特性........................................................................................................21
5 v& g2 {) |4 a/ V1 D! m6.3：ECL 器件的使用原则................................................................................................ 22
' ^7 a, w/ d, L# r1 ^8 H9 A7、GTL 器件的原理和特点................................................................................................... 23
4 S- g3 |( O' a1 Y2 J7.1：GTL 器件的特点和电平............................................................................................ 23
7.2：GTL 信号的PCB 设计................................................................................................ 24
7.3：GTL 信号的测试........................................................................................................25
7.4：GTL 信号的时序........................................................................................................25
8 HSTL 电平......................................................................................................................... 25
8.1 基本定义..................................................................................................................... 25
/ W! w: l; O# i) V! ?1.2 HSTL 分类.................................................................................................................... 26
8.3 HSTL 特点及SSTL .....................................................................................................26
9 PECL、LVPECL 电平........................................................................................................... 27
( B' e# l0 D6 C' o! v9.1：PECL/LVPECL 器件的原理和特点............................................................................27
' F# d9 A2 Y* n( ]9.2. PECL/LVPECL 电平输出结构................................................................................... 27
9.3 PECL/LVPECL 信号的输入输出门特点： ..................................................................29
10 CML 电平......................................................................................................................... 30
, T4 t# g( l1 `. t10.1. CML 接口输出结构............................................................................................... 30
2 V' q% H3 u7 S7 k+ g5 q10.2 CML 接口输入结构...................................................................................................30
10.3 CML 电平的输出门和输入门的特点： ....................................................................31
7 J* m- v% ]% k! G11. LVDS 器件的原理和特点.......................................................................................... 32
11.1：LVDS 器件简介........................................................................................................32
11.2 LVDS 器件的工作原理.............................................................................................. 33
6 T, x  A# L5 y3 ~11.3 LVDS 输入输出结构.................................................................................................33
+ D+ z5 e" n5 I, l, _3 `' {1 p11.4 LVDS 电平的特点...................................................................................................35
0 O) i9 P' t- K. k12. CML LVPECL LVDS 简单比较及互连......................................................................... 35
12.1 CML LVPECL LVDS 简单比较..............................................................................35
& q* ^0 R! _* ~9 Q8 g12.2 CML LVPECL LVDS 的互连综述..........................................................................38
12.3 LVPECL 的互连........................................................................................................39
4 _% v  z3 r" |12.4 LVDS 的互连............................................................................................................44
12.5 CML 的互连..............................................................................................................45
7 {; g% g1 f- p# Z# m+ K附录：.................................................................................................................................... 47
附录1. 集成TTL 与非门电路、OC 门电路及其特性..................................................... 47
8 r9 L) C/ r% I8 A# ?附录2． CMOS 门电路及其特点.................................................................................... 59
, v9 H# s+ B: u  G/ `1 D
5 [$ e: i: m# B% x# U1 g2 K

逻辑电平接口入门.pdf

2017-11-13 16:14 上传

点击文件名下载附件

下载积分: 威望 -5

1.37 MB, 下载次数: 16, 下载积分: 威望 -5

---

欢迎光临 EDA365电子工程师网 (http://bbs.elecnest.cn/)

Powered by Discuz! X3.2