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1 逻辑电平的基本组成单元-三极管、MOS 管及其开关特性........................................... 5$ A+ d+ x* s% `; g
1.1 半导体三极管及其开关特性..................................................................................... 5
6 i! g& ^- W+ G) y1.2 MOS 管的开关特性......................................................................................................7
* [( c0 v2 F( Z- X8 _3 S2、逻辑电平简介.................................................................................................................... 8
9 r Z6 w' X- R4 b2 A6 L/ G3、TTL 器件和CMOS 器件的逻辑电平............................................................................ 10+ {8 @& E* e, D" ]) [* R: b
3.1:逻辑电平的一些概念............................................................................................... 10$ `7 A- x& F# s6 b" j
3.2:常用的逻辑电平....................................................................................................... 11 n% D8 M! t: }* j1 O! R/ d# S& j$ ^$ T
3.3:TTL 和CMOS 的逻辑电平关系.................................................................................. 110 l1 h: E+ q; R& G) Y4 _/ Q) U. e
4、TTL 和CMOS 逻辑器件.................................................................................................... 13
* S0 l1 H/ c/ X' g, V7 [4.1:TTL 和CMOS 器件的功能分类.................................................................................. 136 A; n- e5 V; S% B
4.2:TTL 和MOS 逻辑器件的工艺分类特点....................................................................13. k& t7 m% G1 q1 c
4.3:TTL 和CMOS 逻辑器件的电平分类特点..................................................................13
% W. J) y7 u* ^4.4:包含特殊功能的逻辑器件....................................................................................... 14
& a) B3 E* o6 Z' j0 f7 [' v4.5:逻辑器件的使用指南............................................................................................... 15
; u7 M8 |- Z8 u5、TTL、CMOS 器件的互连.................................................................................................. 16' h o: h3 L9 e
5.1:器件的互连总则.......................................................................................................16: t4 M* \1 A e. j7 ^
5.2:5V TTL 门作驱动源..................................................................................................19
' o2 g! U# E: v! k! ^! u% U5.3:3.3V TTL/CMOS 门作驱动源..................................................................................... 192 _' g! E/ g z, S" z) K2 V v
5.4:5V CMOS 门作驱动源................................................................................................ 19
, b8 y8 v- |/ E5.5:2.5V CMOS 逻辑电平的互连.................................................................................... 190 L1 q( ^' T8 b6 Z8 a a
6、ECL 器件的原理和特点................................................................................................... 20
% M; |. x& R5 j/ ?+ R7 w. Y6.1:ECL 器件的原理........................................................................................................20) ?1 a: P; ]+ @* j* j' Y
6.2:ECL 电路的特性........................................................................................................218 W3 n8 p' I- u1 B+ p; ~+ r
6.3:ECL 器件的使用原则................................................................................................ 226 }3 [# \! i( o4 P: Q
7、GTL 器件的原理和特点................................................................................................... 23
- m: f, e. H$ Y) v( |; h7.1:GTL 器件的特点和电平............................................................................................ 23) g7 O8 O3 w* _/ g6 [8 X
7.2:GTL 信号的PCB 设计................................................................................................ 24
& N2 h$ A! f8 I b1 H; Q6 Y0 }7.3:GTL 信号的测试........................................................................................................25
5 [# |& U% F) ?% ^7.4:GTL 信号的时序........................................................................................................25
) E1 X1 M7 Z6 @; j8 HSTL 电平......................................................................................................................... 25, X# f, k1 O0 L9 y" a+ \
8.1 基本定义..................................................................................................................... 25( o9 k# H% t4 _3 d# ~: |
1.2 HSTL 分类.................................................................................................................... 261 a9 f! e! s G5 l8 p
8.3 HSTL 特点及SSTL .....................................................................................................262 `) e& M5 c. _' B- _
9 PECL、LVPECL 电平........................................................................................................... 27: v9 X% Z/ X# _8 L
9.1:PECL/LVPECL 器件的原理和特点............................................................................27
, Y1 G: m+ \( i& {, C8 @% v3 k" p9.2. PECL/LVPECL 电平输出结构................................................................................... 279 H0 j/ K6 ]+ }. {: g
9.3 PECL/LVPECL 信号的输入输出门特点: ..................................................................29
8 n& g/ u% z- H* s10 CML 电平......................................................................................................................... 30
- m$ N( c( c2 k: `10.1. CML 接口输出结构............................................................................................... 30
. h5 `8 k; H' o9 Y5 p1 |9 _10.2 CML 接口输入结构...................................................................................................30
# n' z8 D/ r4 n6 j8 ~% Q2 ~10.3 CML 电平的输出门和输入门的特点: ....................................................................31
N+ }1 n; D% U8 N' h# K k9 A4 ~11. LVDS 器件的原理和特点.......................................................................................... 32( d- ^. t& l! [! U( A9 C g+ |
11.1:LVDS 器件简介........................................................................................................32
- k; R0 `* O1 _: x) V# Y' x7 J- W11.2 LVDS 器件的工作原理.............................................................................................. 33
0 l9 F6 t' N2 H5 I11.3 LVDS 输入输出结构.................................................................................................33
! A' I+ n+ H) q11.4 LVDS 电平的特点...................................................................................................35: c6 m) @/ G; N/ V% U! I
12. CML LVPECL LVDS 简单比较及互连......................................................................... 359 K* i4 r. W, f, V7 f
12.1 CML LVPECL LVDS 简单比较..............................................................................35
! U* I% j9 w+ @+ r2 P12.2 CML LVPECL LVDS 的互连综述..........................................................................389 {% M# L5 u7 L3 ~( h
12.3 LVPECL 的互连........................................................................................................399 v. f4 y' B! i: ]& |; L
12.4 LVDS 的互连............................................................................................................44
$ M8 |+ x% f2 b- V5 n12.5 CML 的互连..............................................................................................................45: O3 [$ W i# k; J. Y
附录:.................................................................................................................................... 47
" U2 e' e- P, I, E6 L- b# H# e5 ?! q附录1. 集成TTL 与非门电路、OC 门电路及其特性..................................................... 47, b' I6 w! |; Q
附录2. CMOS 门电路及其特点.................................................................................... 59# b, A; D% x+ D; J! p4 ~: u
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